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22 {{ "2024-02-22T00:00:00+00:00" | date "MMM" }} '24

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MURATA News

MURATA INTRODUCES WORLD’S SMALLEST HIGH-Q 100V MLCC

The GJM022 is an ideal choice for a wide variety of applications, such as impedance matching and DC cutting applications within RF modules for base stations.

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22 {{ "2024-02-22T00:00:00+00:00" | date "MMM" }} '24

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TDK News

TDK EXTENDS AUTOMOTIVE SERIES OF VARISTORS WITH NEW MODELS FOR LIN AND CAN

AVRH series is compliant with AEC-Q200 automotive standard with high operating temperatures up to 150 °C.

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21 {{ "2024-02-21T00:00:00+00:00" | date "MMM" }} '24

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Vishay News

Vishay Intertechnology's redesigned INT-A-PAK IGBT power modules reduce conduction and switching losses

Built on Trench IGBT Technology, Half-Bridge Devices Offer Choice of Low VCE(ON) or Low Eoff for High-Current Inverter Stages.

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21 {{ "2024-02-21T00:00:00+00:00" | date "MMM" }} '24

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Toshiba News

Toshiba announces new photorelays for semiconductor test applications

New device offers low voltage drive and high temperature operation.

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21 {{ "2024-02-21T00:00:00+00:00" | date "MMM" }} '24

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Anritsu News

Anritsu Enhances Solution to Support 6 GHz Band RF Test for 5G FR1 Devices

Anritsu Corporation has introduced new NR Licensed 6GHz Band Measurement MX800010A-014 software for its MT8000A Radio Communication Test Station. The system now supports RF tests1 in the 6 GHz band (5.925 GHz to 7.125 GHz) for 5G FR12 devices.

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21 {{ "2024-02-21T00:00:00+00:00" | date "MMM" }} '24

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Emerson

Emerson’s New Compact, Rugged PC Built to Connect Industrial Floor to Cloud

PACSystems IPC 2010, pre-loaded with Movicon software and PACEdge IIoT platform, delivers high-performance computing for industrial edge data visualization applications.

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21 {{ "2024-02-21T00:00:00+00:00" | date "MMM" }} '24

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iBASE News

Next-Gen Digital Signage Solutions with Smart Technologies

IBASE Technology introduces SI-663-N and SI-663 digital signage players, featuring 13th/12th Gen Intel^® Core™ processors and Intel^® Iris^® Xe display chips for superior performance and energy efficiency.

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21 {{ "2024-02-21T00:00:00+00:00" | date "MMM" }} '24

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Teledyne Flir OEM

Thermal by FLIR Powers New Ruggedized Mobile Phone and Assisted Reality Wearable Solution – on Display at Mobile World Congress

New Devices featuring FLIR Lepton Fill Mobile Device Market Gap and Open New Opportunities with an Intrinsically Safe Wearable.

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21 {{ "2024-02-21T00:00:00+00:00" | date "MMM" }} '24

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Picocom News

Picocom powers Wave Electronics Open RAN equipment

Companies to jointly showcase new O-RU in live end-to-end demonstration at MWC Barcelona 2024.

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21 {{ "2024-02-21T00:00:00+00:00" | date "MMM" }} '24

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LEMO

New LEMO Product Family Portfolio Simplifies Selection Process

LEMO has launched an enhanced product family portfolio to streamline customer selection, offering over 90,000 custom solutions to meet market demands, continuously expanding its offerings.

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International