29 {{ "2024-03-29T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-29T00:00:00+00:00" | date "longDate" }}

Intel News

INTEL GAUDI 2 REMAINS ONLY BENCHMARKED ALTERNATIVE TO NV H100 FOR GENAI PERFORMANCE

The newest MLPerf results for Intel Gaudi 2 accelerator and 5th Gen Intel Xeon demonstrate how Intel is raising the bar for generative AI performance.

Read more…

28 {{ "2024-03-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-28T00:00:00+00:00" | date "longDate" }}

Melexis News

Melexis’ New Approach to Dynamic RGB-LED Application Development

Melexis unveils the ADK81116 application development kit. Designed to simplify the development of dynamic RGB-LED automotive applications, this comprehensive solution comes with pre-loaded configurable firmware.

Read more…

28 {{ "2024-03-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-28T00:00:00+00:00" | date "longDate" }}

IAR Systems News

IAR sets the standard with class-leading support for Renesas’ first general-purpose RISC-V MCUs

IAR has announce enhancements to its premier development environment to support the first general-purpose 32-bit RISC-V MCUs with Renesas’ internally developed CPU core.

Read more…

28 {{ "2024-03-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-28T00:00:00+00:00" | date "longDate" }}

Vishay News

Vishay Intertechnology FRED Pt^® 500 A Ultrafast Soft Recovery Diode Modules in the New TO-244 Gen III Package Deliver High Reliability

Featuring a Common Cathode Configuration, Devices Can Withstand IOL Cycles Up to 5x That of the Previous TO-244 Generation for Improved Life Expectancy While Reducing Losses.

Read more…

28 {{ "2024-03-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-28T00:00:00+00:00" | date "longDate" }}

DFI

DFI Panel PC Delivers Efficiency and Reliability for Semi-Outdoor Applications

DFI’s latest KS101-EHL Panel PC is a robust, efficient, and user-friendly touchscreen computer solution for semi-outdoor applications.

Read more…

28 {{ "2024-03-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-28T00:00:00+00:00" | date "longDate" }}

Trumpf News

TRUMPF to present 980nm VCSEL for long reach at OFC 2024

TRUMPF’s 980nm VCSEL extends transmission reach to 500 meters using optimized multimode fiber.

Read more…

28 {{ "2024-03-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-28T00:00:00+00:00" | date "longDate" }}

ARROW News

ARROW ELECTRONICS LAUNCHES INTELLIGENT VISION ECOSYSTEM

Working with Appletec, Arrow developed the newest IAS module, AP-VISION-AR0830-83, that utilizes the latest generation of onsemi image sensors.

Read more…

27 {{ "2024-03-27T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-27T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba Releases New Microcontrollers with Expanded Code Flash Memory Capacity to Support Firmware Updates

New additions expand Toshiba’s M4K and M4M groups of Arm^® Cortex^®-M4 MCUs for motor control.

Read more…

27 {{ "2024-03-27T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-27T00:00:00+00:00" | date "longDate" }}

Diamond News

VALIDATION OF THE MINI AVIM^® APC PM SPACE GRADE CONNECTOR by Diamond

Diamond SA continues its commitment to deliver superior quality and reliability in our products, especially for critical space applications.

Read more…

27 {{ "2024-03-27T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-27T00:00:00+00:00" | date "longDate" }}

Infineon News

New SSO10T TSC top-side cooling package for power MOSFETs enables highest efficiency for modern automotive applications

Infineon Technologies AG introduces the SSO10T TSC package with OptiMOS™ MOSFET technology.

Read more…

Technical Articles

TDK expands YFF Series filters to meet growing automotive safety demands

Case studies

IDS: Event-Based Cameras Enhance Flow Measurement in Science and Industry

White Paper

Parallel Operation of Power Supplies with User Systems

INTEL GAUDI 2 REMAINS ONLY BENCHMARKED ALTERNATIVE TO NV H100 FOR GENAI PERFORMANCE

The newest MLPerf results for Intel Gaudi 2 accelerator and 5th Gen Intel Xeon demonstrate how Intel is raising the bar for generative AI performance.

Melexis’ New Approach to Dynamic RGB-LED Application Development

Melexis unveils the ADK81116 application development kit. Designed to simplify the development of dynamic RGB-LED automotive applications, this comprehensive solution comes with pre-loaded configurable firmware.

IAR sets the standard with class-leading support for Renesas’ first general-purpose RISC-V MCUs

IAR has announce enhancements to its premier development environment to support the first general-purpose 32-bit RISC-V MCUs with Renesas’ internally developed CPU core.

Vishay Intertechnology FRED Pt^® 500 A Ultrafast Soft Recovery Diode Modules in the New TO-244 Gen III Package Deliver High Reliability

Featuring a Common Cathode Configuration, Devices Can Withstand IOL Cycles Up to 5x That of the Previous TO-244 Generation for Improved Life Expectancy While Reducing Losses.

DFI Panel PC Delivers Efficiency and Reliability for Semi-Outdoor Applications

DFI’s latest KS101-EHL Panel PC is a robust, efficient, and user-friendly touchscreen computer solution for semi-outdoor applications.

TRUMPF to present 980nm VCSEL for long reach at OFC 2024

TRUMPF’s 980nm VCSEL extends transmission reach to 500 meters using optimized multimode fiber.

ARROW ELECTRONICS LAUNCHES INTELLIGENT VISION ECOSYSTEM

Working with Appletec, Arrow developed the newest IAS module, AP-VISION-AR0830-83, that utilizes the latest generation of onsemi image sensors.

Toshiba Releases New Microcontrollers with Expanded Code Flash Memory Capacity to Support Firmware Updates

New additions expand Toshiba’s M4K and M4M groups of Arm^® Cortex^®-M4 MCUs for motor control.

VALIDATION OF THE MINI AVIM^® APC PM SPACE GRADE CONNECTOR by Diamond

Diamond SA continues its commitment to deliver superior quality and reliability in our products, especially for critical space applications.

New SSO10T TSC top-side cooling package for power MOSFETs enables highest efficiency for modern automotive applications

Infineon Technologies AG introduces the SSO10T TSC package with OptiMOS™ MOSFET technology.

International

Technical Articles

Case studies

White Paper

The newest MLPerf results for Intel Gaudi 2 accelerator and 5th Gen Intel Xeon demonstrate how Intel is raising the bar for generative AI performance.

Melexis unveils the ADK81116 application development kit. Designed to simplify the development of dynamic RGB-LED automotive applications, this comprehensive solution comes with pre-loaded configurable firmware.

IAR has announce enhancements to its premier development environment to support the first general-purpose 32-bit RISC-V MCUs with Renesas’ internally developed CPU core.

Featuring a Common Cathode Configuration, Devices Can Withstand IOL Cycles Up to 5x That of the Previous TO-244 Generation for Improved Life Expectancy While Reducing Losses.

DFI’s latest KS101-EHL Panel PC is a robust, efficient, and user-friendly touchscreen computer solution for semi-outdoor applications.

TRUMPF’s 980nm VCSEL extends transmission reach to 500 meters using optimized multimode fiber.

Working with Appletec, Arrow developed the newest IAS module, AP-VISION-AR0830-83, that utilizes the latest generation of onsemi image sensors.

New additions expand Toshiba’s M4K and M4M groups of Arm® Cortex®-M4 MCUs for motor control.

Diamond SA continues its commitment to deliver superior quality and reliability in our products, especially for critical space applications.

Infineon Technologies AG introduces the SSO10T TSC package with OptiMOS™ MOSFET technology.

International

New additions expand Toshiba’s M4K and M4M groups of Arm^® Cortex^®-M4 MCUs for motor control.