27 {{ "2024-06-27T00:00:00+00:00" | date "MMM" }} '24

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Arduino News

Arduino shield simplifies use of fibre-optic datalink in MPU designs

OMC, the pioneer in optoelectronics design & manufacture, has launched an H19 fibre optic shield, compatible with Arduino Uno, to demonstrate how an optical fibre datalink can easily be incorporated into a microprocessor-based design.

Read more…

27 {{ "2024-06-27T00:00:00+00:00" | date "MMM" }} '24

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ARROW News

Arrow Electronics V2G reference design accelerates EV charger development

Arrow Electronics has unveiled a data-communication reference design for electric vehicles (EV) charging that combines software stacks for state-of-the-art protocols and a HomePlug Green PHY hardware module.

Read more…

27 {{ "2024-06-27T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-06-27T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM Develops a Novel VCSELED™ Infrared Light Source that Combines Features of VCSELs and LEDs

Low temperature dependence together with wide angle emission and uniform light output contribute to the evolution of automotive driving assistance technologies.

Read more…

27 {{ "2024-06-27T00:00:00+00:00" | date "MMM" }} '24

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Intel News

INTEL XEON PROCESSORS ACCELERATE GENAI WORKLOADS WITH AIBLE

For customers running GenAI workloads, Aible’s serverless solutions lower costs, embed intelligence and improve efficiency for RAG and fine-tuning on Intel Xeon processors.

Read more…

26 {{ "2024-06-26T00:00:00+00:00" | date "MMM" }} '24

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Cadence News

Cadence Expands System IP Portfolio with Network on Chip to Optimize Electronic System Connectivity

Cadence Janus NoC enables design teams to achieve better PPA faster and with lower risk, freeing up valuable engineering resources for SoC differentiation.

Read more…

26 {{ "2024-06-26T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-06-26T00:00:00+00:00" | date "longDate" }}

NETGEAR News

NETGEAR Introduces New Addition To Industry-Leading WiFi 7 Home Networking Product Lineup

New Nighthawk Router expands NETGEAR’s WiFi 7 portfolio offering incredible value for multi-gig speeds and revolutionary performance.

Read more…

26 {{ "2024-06-26T00:00:00+00:00" | date "MMM" }} '24

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Toshiba News

TOSHIBA ANNOUNCES MG10-D SERIES OF ENTERPRISE HDDS WITH CAPACITIES UP TO 10TB

Built for the increasing application demands of enterprise server and storage solutions, the MG10-D Series delivers a new level of performance.

Read more…

25 {{ "2024-06-25T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-06-25T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon Expands AIROC Wi-Fi 6/6E Portfolio with CYW5591x MCUs

The new family of devices features long-range Wi-Fi 6/6E and Bluetooth Low Energy 5.4, enabling cost-optimized, power-efficient, small form-factor products for smart home, industrial, wearables, and IoT applications.

Read more…

25 {{ "2024-06-25T00:00:00+00:00" | date "MMM" }} '24

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HARTING USA

Bridging Dimensions

How HARTING and Altium Revolutionized 3D-Circuits Design.

Read more…

24 {{ "2024-06-24T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-06-24T00:00:00+00:00" | date "longDate" }}

CEA Leti News

CEA-Leti Showcases 3D Integration Advances for More Than Moore & RF Devices at VLSI Conference

CEA-Leti scientists presented three papers at the IEEE Symposium on VLSI Technology and Circuits, highlighting their progress in 3D integration technologies for designing More than Moore systems, particularly RF integrated systems.

Read more…

Technical Articles

What You Should Know About RFID Tags

Case studies

IDS: See. Align. Place

White Paper

Maximize Your Power System Efficiency — Download Our Whitepaper!

Arduino shield simplifies use of fibre-optic datalink in MPU designs

OMC, the pioneer in optoelectronics design & manufacture, has launched an H19 fibre optic shield, compatible with Arduino Uno, to demonstrate how an optical fibre datalink can easily be incorporated into a microprocessor-based design.

Arrow Electronics V2G reference design accelerates EV charger development

Arrow Electronics has unveiled a data-communication reference design for electric vehicles (EV) charging that combines software stacks for state-of-the-art protocols and a HomePlug Green PHY hardware module.

ROHM Develops a Novel VCSELED™ Infrared Light Source that Combines Features of VCSELs and LEDs

Low temperature dependence together with wide angle emission and uniform light output contribute to the evolution of automotive driving assistance technologies.

INTEL XEON PROCESSORS ACCELERATE GENAI WORKLOADS WITH AIBLE

For customers running GenAI workloads, Aible’s serverless solutions lower costs, embed intelligence and improve efficiency for RAG and fine-tuning on Intel Xeon processors.

Cadence Expands System IP Portfolio with Network on Chip to Optimize Electronic System Connectivity

Cadence Janus NoC enables design teams to achieve better PPA faster and with lower risk, freeing up valuable engineering resources for SoC differentiation.

NETGEAR Introduces New Addition To Industry-Leading WiFi 7 Home Networking Product Lineup

New Nighthawk Router expands NETGEAR’s WiFi 7 portfolio offering incredible value for multi-gig speeds and revolutionary performance.

TOSHIBA ANNOUNCES MG10-D SERIES OF ENTERPRISE HDDS WITH CAPACITIES UP TO 10TB

Built for the increasing application demands of enterprise server and storage solutions, the MG10-D Series delivers a new level of performance.

Infineon Expands AIROC Wi-Fi 6/6E Portfolio with CYW5591x MCUs

The new family of devices features long-range Wi-Fi 6/6E and Bluetooth Low Energy 5.4, enabling cost-optimized, power-efficient, small form-factor products for smart home, industrial, wearables, and IoT applications.

Bridging Dimensions

How HARTING and Altium Revolutionized 3D-Circuits Design.

CEA-Leti Showcases 3D Integration Advances for More Than Moore & RF Devices at VLSI Conference

CEA-Leti scientists presented three papers at the IEEE Symposium on VLSI Technology and Circuits, highlighting their progress in 3D integration technologies for designing More than Moore systems, particularly RF integrated systems.

International