28 {{ "2023-03-28T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-28T00:00:00+00:00" | date "longDate" }}

Segger News

SEGGER's Ozone is now available for macOS ( M1/M2 ) on ARM-core

The new build optimizes and unleashes the performance of macOS on the Apple silicon platform, the software has always been multi-platform, for 32 and 64-bit cores, both Intel and Arm.

Read more…

28 {{ "2023-03-28T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-28T00:00:00+00:00" | date "longDate" }}

Samsung News

SAMSUNG'S NEW PM9C1A TAKES PC EFFICIENCY TO NEW HEIGHTS

With new leaps in speed, efficiency, and security, PM9C1a is an SSD that elevates performance for laptops and PCs.

Read more…

28 {{ "2023-03-28T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-28T00:00:00+00:00" | date "longDate" }}

Cambridge GaN Devices News

Ruggedness of Cambridge GaN devices demonstrated in Virginia Tech paper at Apec

70 V over-voltage capability combines with intelligent on-chip protection to deliver highest GaN reliability and ruggedness.

Read more…

27 {{ "2023-03-27T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-27T00:00:00+00:00" | date "longDate" }}

Leuze

Production at full capacity and 25 percent growth in sales

2022 was again a strong sales year for Leuze. Leuze far exceeded its ambitious growth targets for last year. It has taken a major step towards its goal of doubling its sales from 2020 to 2025.

Read more…

27 {{ "2023-03-27T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-27T00:00:00+00:00" | date "longDate" }}

Arduino News

Arduino^® UNO R4: A Groundbreaking Addition to the UNO Family

Arduino is excited to introduce the latest addition to its iconic UNO family: the UNO R4. With no plans to discontinue the popular UNO R3, the UNO R4 will come in two versions – UNO R4 WiFi and UNO R4 Minima – offering unprecedented performance and possibilities for the maker community.

Read more…

27 {{ "2023-03-27T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-27T00:00:00+00:00" | date "longDate" }}

Rohde & Schwarz - France

LDACS - The future of ATC communications

LDACS is set to be the worldwide standard in ATC communications, opening up entirely new use cases for airlines and communications service providers.

Read more…

24 {{ "2023-03-24T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-24T00:00:00+00:00" | date "longDate" }}

Anritsu News

ANRITSU ECALL TEST SOLUTION CERTIFIED AS A PSAP SIMULATOR

The eCall Tester MX703330E software has successfully conducted the independent certification as a PSAP Simulator by NavCert, an EU-accredited test body.

Read more…

24 {{ "2023-03-24T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-24T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon's AIROC CYW20829 Bluetooth LE SoC complies with the latest Bluetooth specification 5.4

The AIROC CYW20829 Bluetooth^® LE System-on-Chip (SoC) from Infineon Technologies AG complies with the new Bluetooth specification 5.4.

Read more…

24 {{ "2023-03-24T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-24T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas’ New RZ/T2L Industrial MPU Enables Fast and Accurate Real-Time Control with EtherCAT Communication

Software Compatibility with Other Renesas MPUs/MCUs Allows Developers to Seamlessly Implement Scalable Design.

Read more…

23 {{ "2023-03-23T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-03-23T00:00:00+00:00" | date "longDate" }}

Samsung News

Samsung unveils a new Ultra-Wideband Chipset for Mobile and Automotive Applications

Samsung Electronics has released its first ultra-wideband chipset, the Exynos Connect U100, with single-digit centimeter accuracy for use in mobile, automotive and IoT devices.

Read more…

Technical Articles

THE FUTURE OF 5G & AI IN TELECOMMUNICATIONS

SEGGER's Ozone is now available for macOS ( M1/M2 ) on ARM-core

The new build optimizes and unleashes the performance of macOS on the Apple silicon platform, the software has always been multi-platform, for 32 and 64-bit cores, both Intel and Arm.

SAMSUNG'S NEW PM9C1A TAKES PC EFFICIENCY TO NEW HEIGHTS

With new leaps in speed, efficiency, and security, PM9C1a is an SSD that elevates performance for laptops and PCs.

Ruggedness of Cambridge GaN devices demonstrated in Virginia Tech paper at Apec

70 V over-voltage capability combines with intelligent on-chip protection to deliver highest GaN reliability and ruggedness.

Production at full capacity and 25 percent growth in sales

2022 was again a strong sales year for Leuze. Leuze far exceeded its ambitious growth targets for last year. It has taken a major step towards its goal of doubling its sales from 2020 to 2025.

Arduino^® UNO R4: A Groundbreaking Addition to the UNO Family

Arduino is excited to introduce the latest addition to its iconic UNO family: the UNO R4. With no plans to discontinue the popular UNO R3, the UNO R4 will come in two versions – UNO R4 WiFi and UNO R4 Minima – offering unprecedented performance and possibilities for the maker community.

LDACS - The future of ATC communications

LDACS is set to be the worldwide standard in ATC communications, opening up entirely new use cases for airlines and communications service providers.

ANRITSU ECALL TEST SOLUTION CERTIFIED AS A PSAP SIMULATOR

The eCall Tester MX703330E software has successfully conducted the independent certification as a PSAP Simulator by NavCert, an EU-accredited test body.

Infineon's AIROC CYW20829 Bluetooth LE SoC complies with the latest Bluetooth specification 5.4

The AIROC CYW20829 Bluetooth^® LE System-on-Chip (SoC) from Infineon Technologies AG complies with the new Bluetooth specification 5.4.

Renesas’ New RZ/T2L Industrial MPU Enables Fast and Accurate Real-Time Control with EtherCAT Communication

Software Compatibility with Other Renesas MPUs/MCUs Allows Developers to Seamlessly Implement Scalable Design.

Samsung unveils a new Ultra-Wideband Chipset for Mobile and Automotive Applications

Samsung Electronics has released its first ultra-wideband chipset, the Exynos Connect U100, with single-digit centimeter accuracy for use in mobile, automotive and IoT devices.

International

Technical Articles

The new build optimizes and unleashes the performance of macOS on the Apple silicon platform, the software has always been multi-platform, for 32 and 64-bit cores, both Intel and Arm.

With new leaps in speed, efficiency, and security, PM9C1a is an SSD that elevates performance for laptops and PCs.

70 V over-voltage capability combines with intelligent on-chip protection to deliver highest GaN reliability and ruggedness.

2022 was again a strong sales year for Leuze. Leuze far exceeded its ambitious growth targets for last year. It has taken a major step towards its goal of doubling its sales from 2020 to 2025.

Arduino is excited to introduce the latest addition to its iconic UNO family: the UNO R4. With no plans to discontinue the popular UNO R3, the UNO R4 will come in two versions – UNO R4 WiFi and UNO R4 Minima – offering unprecedented performance and possibilities for the maker community.

LDACS is set to be the worldwide standard in ATC communications, opening up entirely new use cases for airlines and communications service providers.

The eCall Tester MX703330E software has successfully conducted the independent certification as a PSAP Simulator by NavCert, an EU-accredited test body.

The AIROC CYW20829 Bluetooth® LE System-on-Chip (SoC) from Infineon Technologies AG complies with the new Bluetooth specification 5.4.

Software Compatibility with Other Renesas MPUs/MCUs Allows Developers to Seamlessly Implement Scalable Design.

Samsung Electronics has released its first ultra-wideband chipset, the Exynos Connect U100, with single-digit centimeter accuracy for use in mobile, automotive and IoT devices.

International

The AIROC CYW20829 Bluetooth^® LE System-on-Chip (SoC) from Infineon Technologies AG complies with the new Bluetooth specification 5.4.