The next stage of Industry 4.0: With the "Manufacturing-X" initiative, the Industry 4.0 platform is creating a sovereign data space across industries and companies - with the aim of enabling multilateral cooperation along supply chains and taking digital value creation processes to a new level.
The Companion IC is a cost-effective and power-saving option with high speed, improved range and greater reliability. It can be combined with Ultra Low Power technologies.
Ansys' comprehensive power analytics reduce project risk, improve predictive accuracy, and accelerate time to market for Axelera AI’s new Metis AI Platform.
Fischer Elektronik GmbH & Co. KG has expanded its extensive range of thermal conductive materials to include new pasty gel thermal conductive materials.
LEMO's new 1S.275 Series push-pull connectors are compliant with the SMPTE ST 2082-1 standard and provide 8 times the bandwidth of HD-SDI in a single link.
The new security solution from IAR allows embedded developers to easily add robust security to existing applications even at a late stage of the software development process and go straight into production.