22
'22
Written on
Keysight technologies News
22
'22
Written on
CEVA News
CEVA Accelerates 5G Infrastructure Rollout with Industry's First Baseband Platform IP for 5G RAN ASICs
CEVA, Inc., the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions, today introduced PentaG-RAN, the industry's first 5G baseband platform IP for ASICs targeting cellular infrastructure in both base station and radio configurations, including distributed units (DU), and Remote Radio Units (RRU), from small cell to Massive Multiple-Input, Multiple Output (mMIMO).
22
'22
Written on
Sivers Semiconductors News
Sivers Semiconductors exhibits together with Richardson RFPD at European Microwave Week 2022
Sivers Semiconductors AB announces today that its subsidiary Sivers Wireless will exhibit at the European Microwave Exhibition, 27-29 September, during the European Microwave Week in Milan, Italy, together with its partner Richardson RFPD in booth #C28.
21
'22
Written on
Microchip News
Microchip Unveils Industry’s First Terabit-scale Secure Ethernet PHY Family with Port Aggregation for Enterprise and Cloud Interconnect
META-DX2+ enables OEMs to double router and switch system capacities with 112G PAM4 connectivity for 800G ports, adds encryption and Class C/D precision timing.
21
'22
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E+E ELEKTRONIK News
HTE & TEE301 Expand Sensing Element Series for Humidity and Temperature
The new HTE301 and TEE301 models see E+E Elektronik expand its digital sensing element portfolio to include two cost-optimised product variants.
21
'22
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Tektronix News
Tektronix Adds Powerful New PCI Express® 6.0 Solution to Accelerate the Next Generation of High-Speed Devices
Tektronix delivers fully automated test and validation solution that renders faster test times, higher-quality measurements, and an intuitive user interface.
21
'22
Written on
IDS Imaging Development Systems GmbH
IDS presents six different housing variants
IDS adds numerous new USB3 cameras to its product range. Anyone who needs quickly available industrial cameras for image processing projects is not faced with an easy task due to the worldwide chip shortage.
21
'22
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CEA Leti News
CEA RF Chip Enables Ultralow-Power IoT Connectivity For Remote Devices Via Astrocast’s Nanosatellite Network
Accelerated Development for Communication Module Enables Low-Cost Connectivity for Devices in Maritime, Oil & Gas, and Transport Sectors.
21
'22
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Fraunhofer News
Split manufacturing for trustworthy electronics "Made in Germany"
A consortium of Fraunhofer institutes and well-known German industrial companies is developing a split-manufacturing approach for semiconductor production in the project "Distributed Manufacturing for Novel and Trustworthy Electronics T4T". This will enable the secure assembly of subsystems in Germany and safeguard supply chains.
21
'22
Written on
Power Integrations News
