30 {{ "2022-03-30T00:00:00+00:00" | date "MMM" }} '22

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Congatec News

CONGATEC INTRODUCES VEHICLE COMPUTING TECHNOLOGY FOR SMART MOBILITY AT INTERTRAFFIC AMSTERDAM

Congatec – a leading vendor of embedded and edge computing technology – is pleased to introduce new rugged vehicle computing platforms for smart mobility applications in the extended temperature range at Intertraffic Amsterdam, Hall 5/Booth 309.

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30 {{ "2022-03-30T00:00:00+00:00" | date "MMM" }} '22

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Harwin News

HARWIN ADDS MORE SHIELDING OPTIONS FOR GECKO HI-REL CONNECTORS

Harwin has introduced horizontal backshells for its Gecko-Screw-Lok (Gecko-SL) series of lightweight, high-reliability (Hi-Rel) connectors. These backshells ensure a fully EMI/RFI shielded connection for horizontal 1.25mm pitch board-to-cable connections. Previously Gecko EMI/RFI shielding was only available on vertical board-to-cable orientations.

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30 {{ "2022-03-30T00:00:00+00:00" | date "MMM" }} '22

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Anritsu News

Latest EMITE and Anritsu solution ensures compatibility of LTE, WLAN and Bluetooth^®

EMITE and Anritsu Corporation are proud to announce their latest combined solution for testing the compatibility of different connection technologies such as LTE, WLAN and Bluetooth^® wireless technology.

Read more…

30 {{ "2022-03-30T00:00:00+00:00" | date "MMM" }} '22

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Arkema News

Our electroactive polymers showcased in journal SCIENCE

Piezotech^® electroactive polymers offer an infinite range of possibilities in organic electronics. To broaden the knowledge and development of these materials, Arkema collaborates with the world’s leading universities. Recent research led by Pennstate University (USA) was published in the prestigious American scientific journal SCIENCE showcasing these materials of the future.

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30 {{ "2022-03-30T00:00:00+00:00" | date "MMM" }} '22

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Digi-Key News

Digi-Key Electronics Releases Season 2 of City Digital Video Series

Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate shipment, announced the release of Season 2 of its City Digital video series, sponsored by u-blox, Littelfuse and Taoglas. The three-part series dives deeper into smart cities, exploring the ways technology is transforming the modern home and finding its way into all aspects of daily life.

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30 {{ "2022-03-30T00:00:00+00:00" | date "MMM" }} '22

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Intel News

12TH GEN INTEL CORE I9-12900KS LAUNCHES AS WORLD’S FASTEST DESKTOP PROCESSOR

Intel today announced full details and availability for the new 12th Gen Intel^® Core i9-12900KS, the world’s fastest desktop processor1. It delivers up to 5.5 GHz max turbo frequency — in spec with Intel^® Thermal Velocity Boost and features Intel^® Adaptive Boost Technology (Intel^® ABT) to provide the ultimate gaming experience.

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29 {{ "2022-03-29T00:00:00+00:00" | date "MMM" }} '22

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ST News

STMicroelectronics reveals 2.5V rad-hard digital-to-analog converter for next-generation satellite applications

The STMicroelectronics RHRDAC121 radiation-hardened digital-to-analog converter (DAC) operates down to 2.5V for use in modern, low-power system designs that older 3.3V parts cannot support.

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29 {{ "2022-03-29T00:00:00+00:00" | date "MMM" }} '22

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Digi-Key News

Digi-Key Electronics and Analog Devices to Host Webinar on New Edge Artificial Intelligence Use Cases

Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate shipment, will host a webinar in collaboration with Analog Devices, Inc.

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29 {{ "2022-03-29T00:00:00+00:00" | date "MMM" }} '22

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WM5G News

Deciphering Open RAN – Exploring the opportunities of open access connectivity in the 5G era

As connectivity is evolving, Open RAN (Radio Access Network) has rapidly become a hot topic for the 5G industry and the players within it.

Read more…

28 {{ "2022-03-28T00:00:00+00:00" | date "MMM" }} '22

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Intel News

Intel Introduces New ATX PSU Specifications

Intel has published the most significant update to industry power supply specifications since the initial ATX 2.0 specs were introduced in 2003. Updated ATX 3.0 specifications unlock the full power and potential of next-generation hardware and upcoming components built for technologies like PCIe Gen 5.0.ATX 3.0 and ATX12VO 2.0 support next-generation hardware power demands.

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Case studies

Delta Powers Europe’s Largest Solar Park with 3,500 High-Efficiency Inverters

CONGATEC INTRODUCES VEHICLE COMPUTING TECHNOLOGY FOR SMART MOBILITY AT INTERTRAFFIC AMSTERDAM

Congatec – a leading vendor of embedded and edge computing technology – is pleased to introduce new rugged vehicle computing platforms for smart mobility applications in the extended temperature range at Intertraffic Amsterdam, Hall 5/Booth 309.

HARWIN ADDS MORE SHIELDING OPTIONS FOR GECKO HI-REL CONNECTORS

Latest EMITE and Anritsu solution ensures compatibility of LTE, WLAN and Bluetooth^®

EMITE and Anritsu Corporation are proud to announce their latest combined solution for testing the compatibility of different connection technologies such as LTE, WLAN and Bluetooth^® wireless technology.

Our electroactive polymers showcased in journal SCIENCE

Digi-Key Electronics Releases Season 2 of City Digital Video Series

12TH GEN INTEL CORE I9-12900KS LAUNCHES AS WORLD’S FASTEST DESKTOP PROCESSOR

STMicroelectronics reveals 2.5V rad-hard digital-to-analog converter for next-generation satellite applications

The STMicroelectronics RHRDAC121 radiation-hardened digital-to-analog converter (DAC) operates down to 2.5V for use in modern, low-power system designs that older 3.3V parts cannot support.

Digi-Key Electronics and Analog Devices to Host Webinar on New Edge Artificial Intelligence Use Cases

Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate shipment, will host a webinar in collaboration with Analog Devices, Inc.

Deciphering Open RAN – Exploring the opportunities of open access connectivity in the 5G era

As connectivity is evolving, Open RAN (Radio Access Network) has rapidly become a hot topic for the 5G industry and the players within it.

Intel Introduces New ATX PSU Specifications

International

Case studies

Congatec – a leading vendor of embedded and edge computing technology – is pleased to introduce new rugged vehicle computing platforms for smart mobility applications in the extended temperature range at Intertraffic Amsterdam, Hall 5/Booth 309.

EMITE and Anritsu Corporation are proud to announce their latest combined solution for testing the compatibility of different connection technologies such as LTE, WLAN and Bluetooth® wireless technology.

The STMicroelectronics RHRDAC121 radiation-hardened digital-to-analog converter (DAC) operates down to 2.5V for use in modern, low-power system designs that older 3.3V parts cannot support.

Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate shipment, will host a webinar in collaboration with Analog Devices, Inc.

As connectivity is evolving, Open RAN (Radio Access Network) has rapidly become a hot topic for the 5G industry and the players within it.

International

EMITE and Anritsu Corporation are proud to announce their latest combined solution for testing the compatibility of different connection technologies such as LTE, WLAN and Bluetooth^® wireless technology.