09 {{ "2022-06-09T00:00:00+00:00" | date "MMM" }} '22

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Toshiba News

Toshiba’s young engineers: The ability to listen and think drives innovation

Remote work has become the new normal due to the COVID-19 pandemic. Some people use the time freed up from commuting to enrich their private lives, while others use it to study, as an investment in their future selves.

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09 {{ "2022-06-09T00:00:00+00:00" | date "MMM" }} '22

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TDK News

40W and 60W 2” x 1” DC-DC converters have a 4:1 input range and six-sided shielding

TDK Corporation announces the introduction of the TDK-Lambda brand PXD40 and PXD60 series of 40 and 60W DC-DC converters. Packaged in the industry-standard 2” x 1” footprint, the units can operate over a wide 4:1 input range, accepting either a 9 to 36Vdc or 18 to 75Vdc input. Operation from 12V and 24V or 24V and 48V supply voltages reduces inventory carrying costs and improves part availability.

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09 {{ "2022-06-09T00:00:00+00:00" | date "MMM" }} '22

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TDK News

Inductors TDK offers compact inductors with enhanced performance capabilities to address smartphone power circuit demands

TDK Corporation has developed the new TFM201208BLE series of inductors optimized for space-constrained smartphone power circuits. These are available in 0.24, 0.33 and 0.47 µH versions. Mass production will begin in June 2022.

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09 {{ "2022-06-09T00:00:00+00:00" | date "MMM" }} '22

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Infineon News

“Building new Connections:” Infineon links digital to the real world with new decarbonization and IoT solutions at EW Nuremberg 2022

Infineon Technologies AG today announced plans to highlight how it links the real to the digital world by enabling smart and connected applications at Embedded World 2022 in Nuremberg. A prerequisite for unlocking the potential of the IoT and decarbonization. The company will showcase a variety of smart IoT applications in sectors including smart building and homes, smart factories and smart mobility, along with its latest software and tools for system builders and makers working across the electronics industry.

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09 {{ "2022-06-09T00:00:00+00:00" | date "MMM" }} '22

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CEVA News

CEVA Bluetooth^® 5.3 Platform IP Supports New Auracast Broadcast Audio, Transforming the Shared Audio Experience

Auracast broadcast audio unveiled by Bluetooth SIG enables single audio source Auracast transmitter device to broadcast one or more audio streams to multiple Auracast receiver devices.

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09 {{ "2022-06-09T00:00:00+00:00" | date "MMM" }} '22

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ANSYS News

Ansys Significantly Increases Speed and Capacity of Semiconductor Signoff with Massively Scalable SeaScape Platform

New products Ansys^® Totem-SC and Ansys^® PathFinder-SC optimize power and reliability for automotive, 5G, and high-performance compute semiconductors.

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09 {{ "2022-06-09T00:00:00+00:00" | date "MMM" }} '22

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ST News

STMicroelectronics’ newest NFC readers accelerate payment and consumer application designs

STMicroelectronics’ ST25R3916B-AQWT and ST25R3917B-AQWT NFC Forum Reader devices combine high output power and energy efficiency at a competitive price.

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08 {{ "2022-06-08T00:00:00+00:00" | date "MMM" }} '22

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ST News

STMicroelectronics’ flexible high-voltage op amp targets automotive and industrial environments

The STMicroelectronics TSB622 general-purpose low-power dual operational amplifier (op amp) enhances ruggedness and flexibility in industrial and automotive applications.

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08 {{ "2022-06-08T00:00:00+00:00" | date "MMM" }} '22

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Qualcomm News

Qualcomm Deepens Relationship with PATEO to Create Next-Generation Qinggan Intelligent Cockpit Platform Solution

Qualcomm Technologies, Inc. today announced the company’s relationship with PATEO CONNECT+ (hereinafter referred to as “PATEO”) in the automotive intelligent cockpit field.

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08 {{ "2022-06-08T00:00:00+00:00" | date "MMM" }} '22

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Intel News

Intel Demonstrates Commitment to Security at RSA Conference 2022

Intel’s latest security innovations – cutting-edge product capabilities, demos and real-world use cases – were in the spotlight throughout RSA Conference. At RSA Conference this week in San Francisco, Intel reinforced its commitment to security. At the event, leaders from Intel and its ecosystem partners came together to discuss how the company is addressing some of the toughest security challenges, including hybrid workforces and an increase in connected devices.

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Remote work has become the new normal due to the COVID-19 pandemic. Some people use the time freed up from commuting to enrich their private lives, while others use it to study, as an investment in their future selves.

TDK Corporation has developed the new TFM201208BLE series of inductors optimized for space-constrained smartphone power circuits. These are available in 0.24, 0.33 and 0.47 µH versions. Mass production will begin in June 2022.

Auracast broadcast audio unveiled by Bluetooth SIG enables single audio source Auracast transmitter device to broadcast one or more audio streams to multiple Auracast receiver devices.

New products Ansys® Totem-SC and Ansys® PathFinder-SC optimize power and reliability for automotive, 5G, and high-performance compute semiconductors.

STMicroelectronics’ ST25R3916B-AQWT and ST25R3917B-AQWT NFC Forum Reader devices combine high output power and energy efficiency at a competitive price.

The STMicroelectronics TSB622 general-purpose low-power dual operational amplifier (op amp) enhances ruggedness and flexibility in industrial and automotive applications.

Qualcomm Technologies, Inc. today announced the company’s relationship with PATEO CONNECT+ (hereinafter referred to as “PATEO”) in the automotive intelligent cockpit field.

International

New products Ansys^® Totem-SC and Ansys^® PathFinder-SC optimize power and reliability for automotive, 5G, and high-performance compute semiconductors.