Sivers Semiconductors AB today announced the launch of the new highly integrated, state-of-art 5G NR Radio Frequency Integrated Circuits (RFICs), TRB02801 and TRB03901, together with very high-powered RFIC and antenna RF modules, BFM02801 and BFM03901, covering all licensed 5G mmWave bands.
Industry-leading power density, new architectures and integration can reduce total cost of ownership, helping engineers solve enterprise-server design challenges.
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has developed a model-based development (MBD) simulation technology that shortens verification times for automotive semiconductors by about 90 percent.
Samsung and Cadence co-develop Mixed-Signal OpenAccess-ready PDKs that enable seamless implementation and verification of mixed-signal designs for data centers, networking, 5G, mobile, industrial and automotive applications.
Melexis, a global leader in automotive semiconductors, and emotion3D, a leading provider of camera-based automotive in-cabin analysis software, have joined forces to offer a unique 3D Time-of-Flight (ToF) demonstrator. The solution combines the driver monitoring system (DMS) with high-precision 3D driver localization, to dynamically align augmented reality head-up displays (AR HUD) objects.
With the takeover of the Scottish-French company TPL Vision, wenglor is once again reinforcing its position in the Machine Vision sector – specifically with innovative LED illumination technologies for industrial image processing. The specialist founded in 2005 will be integrated into the wenglor group as a division, but will continue to exist as an independent business unit.