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TE Connectivity News
TE Connectivity launches first-to-market SolderSleeve device for space
The new solution supports space applications requiring low outgassing and resistance to extreme temperatures. TE Connectivity (TE), a world leader in connectivity and sensors, is introducing its SolderSleeve device for space, a first-to-market solution that provides a controlled and reliable solder joint for low outgassing applications, including low earth orbit (LEO) satellites.
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NEC Corporation News
Telenor Deploys 5G xHaul Transport Network with Cisco and NEC to Connect More People and Businesses in Norway and Denmark
NEC Corporation (NEC; TSE: 6701) and Cisco today announced they have been selected by Telenor to deploy 5G xHaul transport networks in Norway and Denmark.
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ANSYS News
Ansys and Electro Magnetic Applications, Inc. Launch EMA3D Charge to Improve Design and Safety of Electronic Components
Ansys EMA3D Charge empowers engineers to predict effects of electrical charging and discharging phenomena.
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ST News
Updates Add Video to STMicroelectronics’ TouchGFX Suite for Richer STM32 User Experiences
STMicroelectronics has released TouchGFX Version 4.18 for user-interface development with STM32* microcontrollers (MCUs), adding video playback, enhanced tools for multi-developer collaboration, and support for new X-NUCLEO display kits.
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Mitsubishi Electric News
Mitsubishi Electric to Ship Samples of Wider-temperature-range CWDM 100Gbps (53Gbaud PAM4) EML Chip for Data Centers
Will reduce power consumption and costs of 400 Gbps optical transceivers for data centers. Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will begin shipping samples of its 100Gbps (53Gbaud) four-level pulse-amplitude modulation (PAM4) electro-absorption modulator (EML) laser diode chip for coarse wavelength division multiplexing (CWDM) on November 1.
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ARROW News
Arrow Electronics recognised in Bourns’ annual distributor awards
Team and individual performances rewarded for EMEA activity. Arrow Electronics has been recognised both for team and individual performances by Bourns in its annual distribution partner awards.
22
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Leuze
Quick-action integration via IO-Link
New MD7 system from Leuze makes automation easier: IO-Link master, hubs and sensors enable high-performance systems to be implemented in the smart factory
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Infineon News
Infineon simplifies secure IoT device-to-cloud authentication with CIRRENT Cloud ID service
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today launched CIRRENT Cloud ID, a service that automates cloud certificate provisioning and IoT device-to-cloud authentication.
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Nexperia News
