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meet IQM News
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ST News
STMicroelectronics Collaborates with Qualcomm Technologies on Unique Sensor Solutions for Next-Gen Mobile, Connected PC, IoT, and Wearable Applications
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications is extending its leadership in sensor technologies by developing innovative software solutions using technology from Qualcomm Technologies, Inc. through the Qualcomm® Platform Solutions Ecosystem program.
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ONSEMI News
ON Semiconductor and Theta Power Systems International Establish Collaboration for Motor Control Applications
Relationship will provide engineers with easy access to advanced motor control techniques.
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AMS News
ams spectral sensing technology chosen by optical metrology specialist ELDIM for COVID-19 (SARS-CoV-2) professional rapid testing
ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, provides the latest sensor technology to ELDIM, a France-based provider of optical metrology technology and related software and hardware design, to support the development of a point of care detection solution for COVID-19 (SARS-CoV-2) using molecular biol- ogy and yielding results in professional healthcare environments in only 40 minutes – instead of the previous several hours or days.
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XILINX News
Xilinx and Samsung Deliver Industry’s First Adaptable Computational Storage Drives
Fully customizable and scalable SmartSSD computational storage platform moves compute closer to storage for accelerated data processing speed and efficiency.
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Hexagon Manufacturing Intelligence News
ALPHACAM Programs Antennas For Driverless Cars
Laser Imaging for Helix Technologies Ensures Toolpath Accuracy.
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IAR Systems News
IAR Systems accelerates development of smart factory applications based on Renesas’ R-IN32M4
New evaluation kit simplifies evaluation of Renesas’ R-IN32M4-CL3 IC for industrial Ethernet communication with CC-Link IE TSN.
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Maxim integrated News
Industry’s Smallest Quad-Output SIMO Power Management IC by Maxim Integrated Achieves 85 Percent Higher Power Density
MAX77655 provides highest number of output channels and cuts solution size by 70 percent for ultra-portable wearables, IoT sensor nodes and health monitors.
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CEVA News
CEVA’s High-Performance DSP Solution to Power Renesas’ Next-Generation Automotive SoC
CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that Renesas has licensed a new, high-performance CEVA DSP to power its next-generation automotive System-on-Chip (SoC).
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Congatec News
