Diodes Incorporated (Nasdaq: DIOD) further reinforces its extensive linear ReDriver IC portfolio via the introduction of two new 3.3V-rated multi-lane active demux devices.
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduced the industry’s first high-voltage microcontroller (MCU) with USB Power Delivery (USB PD) 3.1 support.
For proof of concept, rapid prototyping and small series production, AU-Zone and Toradex, working in close cooperation with Vision Components, have developed the modular Maivin i.MX 8M Plus AI Vision Kit.
With an area of one square millimeter, the NanEyeM is the smallest camera module with a fully digital output for medical endoscopes available on the market.
TDK Corporation (TSE:6762) has extended its range of coupled inductors to include the new EPCOS series B82472D6*. The nine series types cover an inductance range of 2 x 2.2 µH to 2 x 47 µH and are designed for maximum rated currents of 1.1 A to 4.3 A.