NXP Semiconductors N.V. (NASDAQ: NXPI), a world leader in automotive processing, and TSMC (TWSE: 2330, NYSE: TSM) today announced the release of NXP’s S32G2 vehicle network processors and the S32R294 radar processor into volume production on TSMC’s advanced 16 nanometer (nm) FinFET process technology.
Telit, a global enabler of the Internet of Things (IoT), today announced an expansion of its partnership with Hi-Mix Eletrônicos S/A, an Electronic Manufacturing Service (EMS) provider in Brazil, to include production of LTE modules.
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Metalenz Inc., the pioneer in meta-surface design and commercialization, today announced a co-development and license agreement that will see ST develop manufacturing processes for Metalenz’s meta-optics technology for next-generation smartphones, consumer devices, healthcare, and automotive applications.
Siemens today announced that the newest version of its Nucleus ReadyStart software for Arm®-based devices has been updated to provide enhanced support for the Arm Cortex® family of processors.
Today at the TSMC 2021 Online Technology Symposium, Siemens Digital Industries Software announced that its Calibre® nmPlatform tools and Analog FastSPICE platform are now both qualified for TSMC’s advanced N3 and N4 processes.
ROHM Co., Ltd. (Head Office: Kyoto City) has announced the formulation of its Medium-Term Management Plan ‘MOVING FORWARD to 2025’ in order to accelerate social contribution through business activities based on its Company Mission and Management Vision.
In line with the transformative Chrysalis upgrades to the IOTA Foundation’s Distributed Ledger Technology (DLT) and infrastructure, STMicroelectronics has announced the completion, validation, and availability of a fresh new version of the X-CUBE-IOTA1 expansion software package, including integrated IOTA C library, for the STM32Cube microcontroller software development ecosystem.