01 {{ "2021-02-01T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-02-01T00:00:00+00:00" | date "longDate" }}

Infineon News

Transparency and object identity: Infineon and DIGISEQ develop secured physical asset verification to provide end-to-end brand protection

Joint press release of DIGISEQ and Infineon Technologies AG.

Read more…

29 {{ "2021-01-29T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-01-29T00:00:00+00:00" | date "longDate" }}

Infineon News

Research project on quantum computing: Infineon contributes expertise in industrialization

Infineon Technologies AG is working in the joint project “German Quantum Computer based on Superconducting Qubits” (GeQCoS) together with leading scientists from five research institutes in Germany to drive forward the development and industrialization of quantum computing.

Read more…

29 {{ "2021-01-29T00:00:00+00:00" | date "MMM" }} '21

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AMS News

ams honored with the Huaqin Technology Best Collaboration Award 2020

ams (SIX: AMS), a leading worldwide supplier of high-performance sensor solutions, today announced the company received the Best Collaboration Award at the 2020 Huaqin Core Supplier Conference for its excellent product performance, delivery capability, and service.

Read more…

29 {{ "2021-01-29T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-01-29T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight Delivers 5G-Scale Quality of Service Monitoring for Mobile Network Operators

Enables scalable, subscriber-aware visibility into 4G and 5G packet core using the Vision X network packet broker.

Read more…

29 {{ "2021-01-29T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-01-29T00:00:00+00:00" | date "longDate" }}

Beckhoff News

Beckhoff expert is a decision maker in the IEEE Standards Association (SA)

Dr. Karl Weber appointed to the Standards Board of IEEE.

Read more…

29 {{ "2021-01-29T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-01-29T00:00:00+00:00" | date "longDate" }}

Stratasys News

WHERE INNOVATION HAPPENS

Google ATAP uses 3D printing to design brand-new tech experiences.

Read more…

29 {{ "2021-01-29T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-01-29T00:00:00+00:00" | date "longDate" }}

Ngk insulators News

CES 2021 Report: The future of IoT is maintenance-free

At CES 2021, NGK Insulators, Ltd. (NGK) exhibited maintenance-free solutions for IoT devices utilizing its flagship EnerCera^® battery series together with various wireless power transfer (WPT) and energy harvesting technologies to break the bottleneck of power sources.

Read more…

28 {{ "2021-01-28T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-01-28T00:00:00+00:00" | date "longDate" }}

Melexis News

Melexis expands IMC-Hall^® current sensor portfolio exceeding measurement range of 2000 A

MLX91216 XHF high-speed current sensor IC eases assembly, boosts accuracy, and enhances stability.

Read more…

28 {{ "2021-01-28T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-01-28T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM expands its miniature PICOLED lineup: Power-Saving Infrared LED for VR/MR/AR Applications

ROHM introduces a new ultra-compact side-emitting (side view) infrared LED, CSL1501RW. The device is ideal for head-mounted displays, industrial headsets, and VR/MR/AR (xR, virtual reality) gaming systems.

Read more…

28 {{ "2021-01-28T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-01-28T00:00:00+00:00" | date "longDate" }}

TDK News

Power Supplies 24Vdc 20A DIN rail mount buffer (hold-up) module has a narrow 49mm width

TDK Corporation (TSE 6762) announces the introduction of the TDK-Lambda DBM20 DIN rail mount 24V 20A buffer module.

Read more…

Market Overview

The 5G RedCap Connects IoT Devices at Lower Cost

Technical Articles

How Solar Radiation Disrupts Electronic Systems and What Solutions Can Protect Them

Case studies

Mitutoyo's Measuring Machines and Equipment Ensuring Quality at Purso-Tools

Transparency and object identity: Infineon and DIGISEQ develop secured physical asset verification to provide end-to-end brand protection

Joint press release of DIGISEQ and Infineon Technologies AG.

Research project on quantum computing: Infineon contributes expertise in industrialization

Infineon Technologies AG is working in the joint project “German Quantum Computer based on Superconducting Qubits” (GeQCoS) together with leading scientists from five research institutes in Germany to drive forward the development and industrialization of quantum computing.

ams honored with the Huaqin Technology Best Collaboration Award 2020

ams (SIX: AMS), a leading worldwide supplier of high-performance sensor solutions, today announced the company received the Best Collaboration Award at the 2020 Huaqin Core Supplier Conference for its excellent product performance, delivery capability, and service.

Keysight Delivers 5G-Scale Quality of Service Monitoring for Mobile Network Operators

Enables scalable, subscriber-aware visibility into 4G and 5G packet core using the Vision X network packet broker.

Beckhoff expert is a decision maker in the IEEE Standards Association (SA)

Dr. Karl Weber appointed to the Standards Board of IEEE.

WHERE INNOVATION HAPPENS

Google ATAP uses 3D printing to design brand-new tech experiences.

CES 2021 Report: The future of IoT is maintenance-free

At CES 2021, NGK Insulators, Ltd. (NGK) exhibited maintenance-free solutions for IoT devices utilizing its flagship EnerCera^® battery series together with various wireless power transfer (WPT) and energy harvesting technologies to break the bottleneck of power sources.

Melexis expands IMC-Hall^® current sensor portfolio exceeding measurement range of 2000 A

MLX91216 XHF high-speed current sensor IC eases assembly, boosts accuracy, and enhances stability.

ROHM expands its miniature PICOLED lineup: Power-Saving Infrared LED for VR/MR/AR Applications

ROHM introduces a new ultra-compact side-emitting (side view) infrared LED, CSL1501RW. The device is ideal for head-mounted displays, industrial headsets, and VR/MR/AR (xR, virtual reality) gaming systems.

Power Supplies 24Vdc 20A DIN rail mount buffer (hold-up) module has a narrow 49mm width

TDK Corporation (TSE 6762) announces the introduction of the TDK-Lambda DBM20 DIN rail mount 24V 20A buffer module.

International

Market Overview

Technical Articles

Case studies

Joint press release of DIGISEQ and Infineon Technologies AG.

Infineon Technologies AG is working in the joint project “German Quantum Computer based on Superconducting Qubits” (GeQCoS) together with leading scientists from five research institutes in Germany to drive forward the development and industrialization of quantum computing.

ams (SIX: AMS), a leading worldwide supplier of high-performance sensor solutions, today announced the company received the Best Collaboration Award at the 2020 Huaqin Core Supplier Conference for its excellent product performance, delivery capability, and service.

Enables scalable, subscriber-aware visibility into 4G and 5G packet core using the Vision X network packet broker.

Dr. Karl Weber appointed to the Standards Board of IEEE.

Google ATAP uses 3D printing to design brand-new tech experiences.

At CES 2021, NGK Insulators, Ltd. (NGK) exhibited maintenance-free solutions for IoT devices utilizing its flagship EnerCera® battery series together with various wireless power transfer (WPT) and energy harvesting technologies to break the bottleneck of power sources.

MLX91216 XHF high-speed current sensor IC eases assembly, boosts accuracy, and enhances stability.

ROHM introduces a new ultra-compact side-emitting (side view) infrared LED, CSL1501RW. The device is ideal for head-mounted displays, industrial headsets, and VR/MR/AR (xR, virtual reality) gaming systems.

TDK Corporation (TSE 6762) announces the introduction of the TDK-Lambda DBM20 DIN rail mount 24V 20A buffer module.

International

At CES 2021, NGK Insulators, Ltd. (NGK) exhibited maintenance-free solutions for IoT devices utilizing its flagship EnerCera^® battery series together with various wireless power transfer (WPT) and energy harvesting technologies to break the bottleneck of power sources.