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Cadence News

Cadence Collaborates with TSMC and Microsoft to Reduce Semiconductor Design Timing Signoff Schedules with the Cloud

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the results of a three-way collaboration with TSMC and Microsoft focused on utilizing cloud infrastructure to reduce semiconductor design signoff schedules. Through this collaboration, common customers will have an accelerated path to complete timing signoff by adopting the Cadence® Tempus Timing Signoff Solution and the Quantus Extraction Solution using TSMC technologies on the Microsoft Azure Cloud with the Cadence CloudBurst Platform.

Fraunhofer News

DC smart grids for production halls

The transition to a sustainable energy economy for industrial manufacturing.

Anritsu News

Anritsu Partners with Bluetest AB for 5G FR1/FR2 OTA Measurements

Anritsu Corporation is pleased to announce its enhanced partnership with Bluetest AB of Sweden offering a new unified test solution for Over The Air (OTA) measurement of 5G mobile terminals.

Congatec News

See and understand

congatec presents Intel IoT RFP Kit for workload consolidation in vision based situational awareness applications.

Paragraf News

Paragraf Partners with CERN to Demonstrate Unique Properties of New Graphene Hall Effect Sensor

Paragraf has embarked on a working partnership with the Magnetic Measurement section at CERN, the European Organization for Nuclear Research, with both parties set to demonstrate how new opportunities for magnetic measurements are opened up through the unique properties of its graphene sensor, particularly its negligible planar Hall effect.

Infineon News

Infineon introduces Semper Secure – world’s most advanced, secured NOR Flash memory for automotive, industrial, and communications markets

With the acquisition of Cypress Semiconductor Corporation, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) enhances its expertise in memory solutions. Infineon today announced the addition of Semper Secure to its award-winning Semper NOR Flash memory platform. Based on Semper NOR Flash’s field-proven and robust smart memory architecture, Semper Secure NOR Flash is the first memory solution to combine security and functional safety in a single NOR flash device to deliver the security, safety, and reliability required for the most advanced connected automotive, industrial, and communications systems.

NXP News

NXP Selects TSMC 5nm Process for Next Generation High Performance Automotive Platform

NXP Semiconductors N.V. announced a collaboration agreement to adopt TSMC’s 5-nanometer (5nm) technology for NXP’s next generation, high-performance automotive platform. This collaboration combines NXP’s automotive design expertise with TSMC’s industry-leading 5nm technology to further drive the transformation of automobiles into powerful computing systems for the road.

ST News

STMicroelectronics’ Reference Design Enables Compact and Cost-Effective Wearables with Social-Distancing, Contact-Tracing, and Remote Capabilities

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announces the availability of a compact and cost-effective reference design ideally suited for monitoring social distancing, assuring remote operation, provisioning, as well as warning, anti-tampering, and potentially providing contact tracing to protect human health in all environments, including in response to global or local pandemic conditions.

Toshiba News

Toyota Vehicles with Toshiba’s Advanced Image Recognition Processor Win Japan’s Highest Preventive Safety Performance Awards for Second Year

Toshiba Electronic Devices & Storage Corporation (“Toshiba”) today announced that, for the second consecutive year, its flagship image recognition processor for driver assistance systems has contributed to the success of Toyota Motor Corporation (“Toyota”) vehicles in the Japan New Car Assessment Program (JNCAP).

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