14 {{ "2020-10-14T00:00:00+00:00" | date "MMM" }} '20

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Dunkermotoren News

A dream start for projects in mechanical engineering

Which developer does not dream of quick test samples to gain first experiences with the drive unit? The newly developed starter set of our new Motor Control Platform fulfills exactly these wishes of the mechanical engineers. The customer can choose between different power packages from 20 W to 270 W.

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14 {{ "2020-10-14T00:00:00+00:00" | date "MMM" }} '20

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Schmalz News

Tolerance to Shape and Size

J. Schmalz GmbH has developed a new gripper for automated handling: The FQE is suitable for a variety of different tasks, including on collaborative robots, and grips workpieces of varying shapes and sizes with speed and reliability.

Read more…

14 {{ "2020-10-14T00:00:00+00:00" | date "MMM" }} '20

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Telit News

Telit ME310G1-WW Module Certified for LTE-M Use by SK Telecom

Featuring the Qualcomm^®9205 LTE modem, the Telit ME310G1-WW is optimized for long battery life and reliable in-building connectivity, with Power Class 3 support.

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14 {{ "2020-10-14T00:00:00+00:00" | date "MMM" }} '20

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TDK News

Inductors: TDK develops miniaturized, high-performance automotive power inductors

TDK Corporation (TSE: 6762) developed new power inductors, BCL322515RT, for use in automotive electronics, intended for insertion into the power line of an automobile electronic control circuit. Mass production will launch in October 2020.

Read more…

14 {{ "2020-10-14T00:00:00+00:00" | date "MMM" }} '20

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EBM Papst News

virtual.COMPAMED - Drives and fans for imaging applications

Instead of meeting in Düsseldorf like every other year, the 2020 medical technology industry meeting will be held virtually. What remains the same is the date: November 16-19, 2020. ebm-papst will be presenting drive technology solutions for the medical sector at virtual.COMPAMED.

Read more…

14 {{ "2020-10-14T00:00:00+00:00" | date "MMM" }} '20

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Flex Power Modules News

High power quarter brick isolated DC/DC converter to address demands of energy-conscious data centers

Continuing to extend its portfolio of high-density DC/DC converter solutions with built-in digital interfaces, Flex Power Modules introduces two variants of the new BMR491 series.

Read more…

14 {{ "2020-10-14T00:00:00+00:00" | date "MMM" }} '20

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D Space News

dSPACE: New Target Simulator for 4-D Radar Sensors Sets Standards

dSPACE is setting standards for testing of 4-D radar sensors with a new target simulator. The DARTS 9040-G is the first simulator worldwide to process multiple radar signals simultaneously with a bandwidth of up to 5 GHz. It allows for the reliable and efficient development of cutting-edge, high-resolution radar sensors for driver assistance systems and autonomous driving.

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14 {{ "2020-10-14T00:00:00+00:00" | date "MMM" }} '20

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Mouser News

Mouser Debuts Technical Resource Centre, a Searchable Collection of Tech Content and Product Information

Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, announces its redesigned Technical Resource Centre, which contains the global distributor’s ever-expanding collection of technical articles, blogs, eBooks, and Methods technology and solutions journal, plus related product information, in a searchable repository.

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13 {{ "2020-10-13T00:00:00+00:00" | date "MMM" }} '20

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DFI

Realizing Truly Remote Management - RemoGuard

As Industrial IoT demands rise in recent decades, the number of connected IoT devices drastically grow.

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13 {{ "2020-10-13T00:00:00+00:00" | date "MMM" }} '20

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PICMG News

PICMG Ratifies MicroSAM – The New Microcontroller-Agnostic Module Form Factor for the Enablement of Smart Sensors

PICMG, a leading consortium for the development of open embedded computing specifications, announces the ratification of the MicroSAM specification. MicroSAM is a new microcontroller-agnostic, ultra-small form-factor module for the enablement of smart sensors.

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Market Overview

Sustainability in Electronic Components: Eco-Friendly Materials and Recycling Initiatives

Technical Articles

Leakage Current Considerations for Medical Power Supplies

Case studies

Inspecting critical infrastructure with the help of intelligent drones

White Paper

Leakage Current Considerations for Medical Power Supplies

A dream start for projects in mechanical engineering

Tolerance to Shape and Size

J. Schmalz GmbH has developed a new gripper for automated handling: The FQE is suitable for a variety of different tasks, including on collaborative robots, and grips workpieces of varying shapes and sizes with speed and reliability.

Telit ME310G1-WW Module Certified for LTE-M Use by SK Telecom

Featuring the Qualcomm^®9205 LTE modem, the Telit ME310G1-WW is optimized for long battery life and reliable in-building connectivity, with Power Class 3 support.

Inductors: TDK develops miniaturized, high-performance automotive power inductors

TDK Corporation (TSE: 6762) developed new power inductors, BCL322515RT, for use in automotive electronics, intended for insertion into the power line of an automobile electronic control circuit. Mass production will launch in October 2020.

virtual.COMPAMED - Drives and fans for imaging applications

Instead of meeting in Düsseldorf like every other year, the 2020 medical technology industry meeting will be held virtually. What remains the same is the date: November 16-19, 2020. ebm-papst will be presenting drive technology solutions for the medical sector at virtual.COMPAMED.

High power quarter brick isolated DC/DC converter to address demands of energy-conscious data centers

Continuing to extend its portfolio of high-density DC/DC converter solutions with built-in digital interfaces, Flex Power Modules introduces two variants of the new BMR491 series.

dSPACE: New Target Simulator for 4-D Radar Sensors Sets Standards

Mouser Debuts Technical Resource Centre, a Searchable Collection of Tech Content and Product Information

Realizing Truly Remote Management - RemoGuard

As Industrial IoT demands rise in recent decades, the number of connected IoT devices drastically grow.

PICMG Ratifies MicroSAM – The New Microcontroller-Agnostic Module Form Factor for the Enablement of Smart Sensors

PICMG, a leading consortium for the development of open embedded computing specifications, announces the ratification of the MicroSAM specification. MicroSAM is a new microcontroller-agnostic, ultra-small form-factor module for the enablement of smart sensors.

International

Market Overview

Technical Articles

Case studies

White Paper

J. Schmalz GmbH has developed a new gripper for automated handling: The FQE is suitable for a variety of different tasks, including on collaborative robots, and grips workpieces of varying shapes and sizes with speed and reliability.

Featuring the Qualcomm®9205 LTE modem, the Telit ME310G1-WW is optimized for long battery life and reliable in-building connectivity, with Power Class 3 support.

TDK Corporation (TSE: 6762) developed new power inductors, BCL322515RT, for use in automotive electronics, intended for insertion into the power line of an automobile electronic control circuit. Mass production will launch in October 2020.

Instead of meeting in Düsseldorf like every other year, the 2020 medical technology industry meeting will be held virtually. What remains the same is the date: November 16-19, 2020. ebm-papst will be presenting drive technology solutions for the medical sector at virtual.COMPAMED.

Continuing to extend its portfolio of high-density DC/DC converter solutions with built-in digital interfaces, Flex Power Modules introduces two variants of the new BMR491 series.

As Industrial IoT demands rise in recent decades, the number of connected IoT devices drastically grow.

PICMG, a leading consortium for the development of open embedded computing specifications, announces the ratification of the MicroSAM specification. MicroSAM is a new microcontroller-agnostic, ultra-small form-factor module for the enablement of smart sensors.

International

Featuring the Qualcomm^®9205 LTE modem, the Telit ME310G1-WW is optimized for long battery life and reliable in-building connectivity, with Power Class 3 support.