17
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TDK News
16
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Infineon News
Infineon introduces Semper Secure – world’s most advanced, secured NOR Flash memory for automotive, industrial, and communications markets
With the acquisition of Cypress Semiconductor Corporation, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) enhances its expertise in memory solutions. Infineon today announced the addition of Semper Secure to its award-winning Semper NOR Flash memory platform. Based on Semper NOR Flash’s field-proven and robust smart memory architecture, Semper Secure NOR Flash is the first memory solution to combine security and functional safety in a single NOR flash device to deliver the security, safety, and reliability required for the most advanced connected automotive, industrial, and communications systems.
16
'20
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Paragraf News
Paragraf Partners with CERN to Demonstrate Unique Properties of New Graphene Hall Effect Sensor
Paragraf has embarked on a working partnership with the Magnetic Measurement section at CERN, the European Organization for Nuclear Research, with both parties set to demonstrate how new opportunities for magnetic measurements are opened up through the unique properties of its graphene sensor, particularly its negligible planar Hall effect.
16
'20
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Congatec News
See and understand
congatec presents Intel IoT RFP Kit for workload consolidation in vision based situational awareness applications.
16
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Phoenix Contact News
Mobile thermal transfer printer for creating markings directly on site
The new handy THERMOMARK GO thermal transfer printer from Phoenix Contact allows you to create markings flexibly, anywhere, and at any time.
16
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Anritsu News
Anritsu Partners with Bluetest AB for 5G FR1/FR2 OTA Measurements
Anritsu Corporation is pleased to announce its enhanced partnership with Bluetest AB of Sweden offering a new unified test solution for Over The Air (OTA) measurement of 5G mobile terminals.
16
'20
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Fraunhofer News
DC smart grids for production halls
The transition to a sustainable energy economy for industrial manufacturing.
16
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Cadence News
Cadence Collaborates with TSMC and Microsoft to Reduce Semiconductor Design Timing Signoff Schedules with the Cloud
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the results of a three-way collaboration with TSMC and Microsoft focused on utilizing cloud infrastructure to reduce semiconductor design signoff schedules. Through this collaboration, common customers will have an accelerated path to complete timing signoff by adopting the Cadence® Tempus Timing Signoff Solution and the Quantus Extraction Solution using TSMC technologies on the Microsoft Azure Cloud with the Cadence CloudBurst Platform.
15
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Emerson Industrial Automation
Emerson’s Laser Welder Improves Manufacturing Efficiency and Quality of Smaller Plastic Parts
Branson GLX Micro provides precise, clean and repeatable welds of delicate and intricate components
15
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AXON CABLE News
