Collaboration on TSMC’s COUPE silicon photonics platform dramatically speeds chip-to-chip and machine-to-machine communication for cloud, datacenters, HPC, and AI chips.
Innodisk announces the launch of its industry’s first MIPI over Type-C solution. This exclusive technology overcomes traditional MIPI cable length limitations, allowing embedded camera modules to be positioned farther from the system.
CEA-Leti has been chosen to coordinate two projects to help build first-class 6G technology capabilities and boost standardization efforts across Europe.
New flow provides an efficient, integrated radio frequency circuit re-design solution based on Synopsys Custom Design Family, Keysight Electromagnetic Simulation, and Ansys Device Synthesis.