11 {{ "2023-08-11T00:00:00+00:00" | date "MMM" }} '23

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Mouser News

Mouser unveils Digi XBee 3 Global GNSS LTE CAT 1 Development Kit for IoT Applications

Digi XBee^® 3 Global LTE Cat 1 embedded modem enables designers to integrate LTE cellular technology efficiently, eliminating costly FCC and carrier certification processes for devices and applications.

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11 {{ "2023-08-11T00:00:00+00:00" | date "MMM" }} '23

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Infineon News

Infineon introduces new automotive 60 V and 120 V OptiMOS 5 in TOLx packages for 24 V-72 V supplied high power ECUs

The electrification of the transportation system is advancing continuously. In addition to passenger cars, 2- and 3-wheelers as well as light vehicles are increasingly being electrified.

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10 {{ "2023-08-10T00:00:00+00:00" | date "MMM" }} '23

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Antaira News

Antaira 5GHz Wireless AP/Client Bridge Simplifies Point-to-Point/Multipoint Applications

Antaira Technologies is providing a secure, cost-effective way to extend wireless networks with the launch of its AMY-5133-AC-PD Wireless Access Point/Client Bridge.

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10 {{ "2023-08-10T00:00:00+00:00" | date "MMM" }} '23

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Thinesolutions News

THine Introduces THEIA-CAM 13MP PDAF Camera Kit for MediaTek Genio 350 and Genio 500

The Kit Allows MediaTek’s Customers to Integrate THine’s Leading-Edge Imaging Capabilities into AI + IoT Products with Minimal Effort.

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10 {{ "2023-08-10T00:00:00+00:00" | date "MMM" }} '23

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FEIG news

FEIG INTRODUCES NEW RFID HYBRID READER MODULE

With the new RFID hybrid module ID CPR70, FEIG ELECTRONIC presents a high-end HF reader that combines the advantages of the two successful predecessors ISC.M02 and CPR.M02.

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09 {{ "2023-08-09T00:00:00+00:00" | date "MMM" }} '23

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Inova Semiconductors News

Inova Semiconductors is going to use Samsung Foundry Services for ISELED products

Samsung Electronics, Inova Semiconductors and CoAsia SEMI, collaborating to introduce ISELED products utilizing Samsungs Semiconductors technologies and CoAsia SEMI services.

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09 {{ "2023-08-09T00:00:00+00:00" | date "MMM" }} '23

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TDK News

TDK OFFERS NEW ULTRA-COMPACT SNAP-IN CAPACITOR SERIES WITH EXTREMELY HIGH CAPACITANCE DENSITY

Due to their high reliability, these RoHS-compatible capacitors are optimal for use in high-end switched-mode power supplies and power supplies for industrial and telecommunications applications.

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09 {{ "2023-08-09T00:00:00+00:00" | date "MMM" }} '23

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SK Hynix News

SK HYNIX SHOWCASES SAMPLES OF WORLD’S FIRST 321-LAYER NAND

The company gave a presentation on the progress of the development of its 321-layer 1Tb TLC 4D NAND Flash and displayed the samples at the Flash Memory Summit (FMS) 2023 taking place Aug. 8-10 in Santa Clara. .

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08 {{ "2023-08-08T00:00:00+00:00" | date "MMM" }} '23

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Teledyne Flir OEM

Teledyne FLIR Introduces Lepton 3.1R Radiometric Thermal Camera Module for Integrators

A Wider Field of View and Scene Temperature Range Enables People, Fire, and Condition Monitoring Applications.

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08 {{ "2023-08-08T00:00:00+00:00" | date "MMM" }} '23

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Integrated Graphene News

Humans to provide energy source for smart devices of the future

Researchers from the Institute of Thin Films, Sensors and Imaging (ITFSI) from the University of the West of Scotland (UWS) explored the use of the 3D graphene foam material Gii by Integrated Graphene as an active layer in an energy generator.

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Digi XBee® 3 Global LTE Cat 1 embedded modem enables designers to integrate LTE cellular technology efficiently, eliminating costly FCC and carrier certification processes for devices and applications.

The electrification of the transportation system is advancing continuously. In addition to passenger cars, 2- and 3-wheelers as well as light vehicles are increasingly being electrified.

Antaira Technologies is providing a secure, cost-effective way to extend wireless networks with the launch of its AMY-5133-AC-PD Wireless Access Point/Client Bridge.

The Kit Allows MediaTek’s Customers to Integrate THine’s Leading-Edge Imaging Capabilities into AI + IoT Products with Minimal Effort.

With the new RFID hybrid module ID CPR70, FEIG ELECTRONIC presents a high-end HF reader that combines the advantages of the two successful predecessors ISC.M02 and CPR.M02.

Samsung Electronics, Inova Semiconductors and CoAsia SEMI, collaborating to introduce ISELED products utilizing Samsungs Semiconductors technologies and CoAsia SEMI services.

Due to their high reliability, these RoHS-compatible capacitors are optimal for use in high-end switched-mode power supplies and power supplies for industrial and telecommunications applications.

The company gave a presentation on the progress of the development of its 321-layer 1Tb TLC 4D NAND Flash and displayed the samples at the Flash Memory Summit (FMS) 2023 taking place Aug. 8-10 in Santa Clara. .

A Wider Field of View and Scene Temperature Range Enables People, Fire, and Condition Monitoring Applications.

Researchers from the Institute of Thin Films, Sensors and Imaging (ITFSI) from the University of the West of Scotland (UWS) explored the use of the 3D graphene foam material Gii by Integrated Graphene as an active layer in an energy generator.

International

Digi XBee^® 3 Global LTE Cat 1 embedded modem enables designers to integrate LTE cellular technology efficiently, eliminating costly FCC and carrier certification processes for devices and applications.