10
'24
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Micron News
09
'24
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Samsung News
Leading Memory Innovation with HBM3E
Samsung is leading the pack with its latest 5th generation high bandwidth memory device.
09
'24
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Melexis News
MELEXIS INTRODUCES MLX90427 POSITION SENSING FOR STEER-BY-WIRE
This product has been specifically engineered to meet the current and future technical requirements of the automotive industry.
08
'24
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Bourns News
Bourns TLVR Inductors Deliver Extremely High Current Capabilities to Match Today’s Data-Driven Application Performance Demands
Engineered with a dual-winding structure and low inductance, the Bourns® Model TLVR1005T and TLVR1105T Series provides fast transient response.
08
'24
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Mediatek News
MediaTek Boosts Flagship Smartphone Performance with Dimensity 9300+ SoC
New chip speeds up generative AI processing at the edge to run LLMs faster.
08
'24
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NETGEAR News
NETGEAR BRINGS WIFI 7 TO ITS FLAGSHIP ORBI FAMILY, UNLEASHING ELITE CONNECTIVITY
NETGEAR Orbi 970 Series boasts elegant, new design, high-performance antennas and groundbreaking Enhanced Dedicated Backhaul.
08
'24
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Rutronik Info
Reliable and secure modules for the European IoT market
Rutronik and Cherry Embedded Solutions GmbH have concluded a distribution agreement for the whole of Europe with immediate effect.
08
'24
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Keysight technologies News
KEYSIGHT INTRODUCES PULSE GENERATOR OPTION FOR HANDHELD ANALYZERS
The new software application makes FieldFox the industry’s only handheld analyzer with a built-in signal generator at frequencies up to 54 GHz.
07
'24
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Infineon News
Infineon provides a broad range of products for Xiaomi’s new SU7 smart electric vehicle
Infineon Technologies AG a global semiconductor leader in power systems and IoT, will provide silicon carbide (SiC) power modules HybridPACK™ Drive G2 CoolSiC™ and bare die products to Xiaomi EV for its recently announced SU7 until 2027.
07
'24
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STMicroelectronics News
