Infineon Technologies AG a global semiconductor leader in power systems and IoT, will provide silicon carbide (SiC) power modules HybridPACK™ Drive G2 CoolSiC™ and bare die products to Xiaomi EV for its recently announced SU7 until 2027.
STMicroelectronics has introduced the ASM330LHBG1 automotive 3-axis accelerometer and 3-axis gyroscope module with a safety-software library that enables a cost-effective solution for functional-safety applications.
With the introduction of the PSoC 4 High Voltage Precision Analog (HVPA)-144K microcontroller, Infineon Technologies AG addresses the automotive battery management sector by integrating high-precision analog and high-voltage subsystems on a single chip.
SECH's high-performance ultracapacitors combine the latest developments in the materials used with innovative and patented high-end manufacturing processes, thus enabling an optimal price-performance ratio.
SGS, the world’s leading testing, inspection and certification company, is delighted to host a complimentary webinar, ‘Are your products Wi-Fi 7 ready?’ on May 16.
Innodisk, a global leader in AI solutions, has taken a pivotal step forward in environmental sustainability with the launch of its latest innovation, the “iCAP Air” air quality management solution.