Automotive component suppliers and OEMs alike are faced with the challenge that every car is unique. It is unique in how, where and by whom it is driven, its design, the purpose of the ride, as well as the road and traffic conditions where it operates.

Infineon Technologies AG has integrated its OPTIGA™ Trust M security controller with Verified Boot technology from Thistle Technologies, a pioneer in advanced security solutions for connected devices.

Infineon Technologies AG introduces the new CoolSiC™ MOSFETs 2000 V in the TO-247PLUS-4-HCC package to meet designers' demand for increased power density without compromising the system's reliability even under demanding high voltage and switching frequency conditions.

Infineon Technologies AG opens a new chapter in power systems and energy conversion and introduces the next generation of silicon carbide (SiC) MOSFET trench technology.

In the highly competitive global semiconductor market, manufacturers are constantly striving for shorter time-to-market. At the same time, the demand for fluid and high-resolution graphical displays is increasing.

Infineon Technologies AG has launched the new Automotive PSoC™ 4100S Max family.

Infineon Technologies AG introduced a new product family of Solid-State Isolators to achieve faster and more reliable circuit switching with protection features not available in optical-based solid state relays (SSR).

Infineon Technologies AG introduces the 750V G1 discrete CoolSiC™ MOSFET to meet the increasing demand for higher efficiency and power density in industrial and automotive power applications.

Infineon TDM2254xD vertical power modules deliver best-in-class electrical and thermal efficiency with high power density and quality.

In a world of increasing connectivity and the growing popularity of the Internet of Things, it is important to simplify interoperability across connected devices and to enhance their security and reliability. The Matter standard 1 was created precisely for this purpose.