The high-performance AURIX TC4Dx features advanced multi-core architecture, AI capabilities, and cutting-edge connectivity, enabling secure and efficient E/E architectures for software-defined vehicles.

The new 3-phase gate driver IC ensures reliable motor control for safety-critical by-wire applications, featuring advanced diagnostics, adaptive MOSFET control, and compatibility with 12V systems.

Infineon unveils the world’s thinnest silicon power wafer, pushing technical boundaries and improving energy efficiency.

Infineon will showcase innovative solutions for clean, safe and smart mobility as well as for green and intelligent living spaces.

CoolSiC Schottky diode 2000 V enables higher efficiency and design simplification in DC link systems up to 1500 VDC.

Fingerprint sensing offers accurate and cost-effective biometric performance.

In battery-powered applications such as motor drives and switched-mode power supplies (SMPS), the power supply architecture often requires that a module can be disconnected from the main supply rail when a fault occurs in that module.

Affordability combined with high performance and efficiency is the key to making electric mobility accessible to a broader market.

Data centers are currently responsible for more than two percent of global energy consumption. Fueled by AI, this number is expected to grow to up to around seven percent in 2030, matching the current energy consumption of India.

Innovative car cockpits, seamless connectivity with new services and improved passive safety: 3D depth sensors play an important role in in-vehicle monitoring systems.