Explore how wireless power can support the next generation of humanoid docking architectures and how Renesas is enabling the technologies to shape the future of humanoid robotics.

Renesas Electronics develops a depletion-mode GaN device enabling simpler converter architectures for solar, EV charging and data-center power systems.

Renesas Electronics introduces a GaN-based HWLLC platform to improve power density and efficiency in industrial and IoT power supply applications.

Renesas launches Renesas 365, a cloud-based platform integrating device selection, system modeling and embedded development workflows.

Renesas Electronics Corporation supplies R-Car V4H to Denso for Toyota’s RAV4 TSS(LSS) control unit, enabling integrated camera, radar and driver monitoring functions.

Renesas Electronics Corporation has developed advanced semiconductor technologies to enable secure, high-speed data processing and chiplet scalability for the next generation of software-defined vehicles.

Configurable 3nm FinFET TCAM achieves 5.27 Mb/mm² density, 0.167 fJ/bit search energy and enhanced functional safety for automotive and high-speed networking applications.

Dual-band, ultra-low-power connectivity enables scalable smart-home and industrial applications requiring continuous wireless performance.

Delivers 9600 MT/s with a 10% bandwidth boost, enhanced signal integrity, advanced diagnostics, and backward compatibility for next-gen AI and HPC workloads.

New RA8M2 and RA8D2 microcontrollers deliver 7300 Coremarks, integrated MRAM, dual Gigabit Ethernet, and advanced graphics for IoT and industrial applications.