JUMPtec unveils new COM and SMARC modules powered by Intel Core 3 and N-Series processors, delivering enhanced performance for embedded and edge computing applications.
Murata’s NXJ1T series offers compact, high-isolation 1W DC-DC converters for demanding industrial, medical, and energy applications with exceptional reliability.
STMicro begins mass production of ST67W611M1 Wi-Fi/Bluetooth module, developed with Qualcomm; Siana sees early success integrating it into STM32-based IoT devices.
Micron’s 1-gamma LPDDR5X delivers industry-leading 10.7Gbps speed, 20% power savings, and the thinnest package, enabling faster, energy-efficient AI on flagship smartphones.
Cliff Electronics expands its FT Connector range with dual USB FeedThroughs, offering compact, cost-effective connectivity solutions for data, power, and modern device integration.
Würth Elektronik's Skoll-I is a compact, certified module combining Bluetooth Classic and LE 5.4, enabling fast, global deployment of new wireless applications.
Tomahawk 6 powers next-gen AI networks with unmatched scale, energy efficiency, and AI-optimized features, supporting 100G/200G SerDes and co-packaged optics for flexibility.