08
'23
Written on
Infineon News
08
'23
Written on
Sivers Semiconductors News
Sivers Semiconductors PARALIA aims to develop fundamental innovations for automotive and aerospace applications
PARALIA is a new EU Horizon Research and Innovation Actions Project funded under the HORIZON-CL4-2022-DIGITAL-EMERGING-01-03 Call, coordinated by Aristotle University of Thessaloniki in Greece. It will run from January 2023 to June 2026.
08
'23
Written on
Powell Electronics News
Smallest and lightest mixed layout Gecko-MT connectors from Harwin available through Powell Electronics
Harwin’s range of Gecko-MT 1.25mm pitch mixed layout connectors is in stock at Powell Electronics, the supplier of connectors and more for high-rel applications including defence, aerospace and industrial.
08
'23
Written on
ST News
STMICROELECTRONICS LAUNCHES NEW ISPU TOOLCHAIN AND SOFTWARE PACKAGE
The new toolchain and software package from STMicroelectronics ease the development of edge processing with intelligent inertial sensors.
05
'23
Written on
Rutronik Info
Rutronik and KEMET's T598 Automotive Series expands portfolio for maximum value
KEMET introduces capacitors with the highest capacitance and lowest ESR values for automotive-qualified polymer capacitors, AEC-Q200 certified.
05
'23
Written on
Infineon News
Infineon's new wireless power transmitter IC is ideal for charging up to 50 W
Infineon Technologies AG introduces the WLC1150 wireless charging transmitter IC, offering a cost-effective solution for higher wireless power transfer.
05
'23
Written on
Mouser News
Mouser Expands Sensor Portfolio to Offer More Real-World Interaction
Mouser Electronics, Inc, recently added several new sensor products to its already comprehensive sensing portfolio.
04
'23
Written on
Anritsu News
Anritsu–MediaTek Collaboration Successfully Verified Wi-Fi 7 Chip Connection with Network Mode
Anritsu Corporation and MediaTek Incorporated (MediaTek) have successfully verified the performance and functions of MediaTek’s Filogic chip for IEEE802.11be wireless LAN (WLAN) by testing RF characteristics with the network mode.
04
'23
Written on
Infineon News
Infineon further diversifies its silicon carbide supplier base; new supplier agreement with SICC on wafers and boules
Infineon Technologies AG has signed an agreement with Chinese silicon carbide (SiC) supplier SICC to diversify Infineon's SiC material supplier base and to secure additional competitive SiC sources.
04
'23
Written on
Deltaq News
