28 {{ "2023-07-28T00:00:00+00:00" | date "MMM" }} '23

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Impulse Embedded News

Intel Announces the NUC’s End-of-Life – Impulse Embedded can provide business continuity

Intel have recently announced that they will be exiting the business of complete PC systems, including NUC mini-PCs and kits. This follows the announcement from earlier in the year that Intel would be exiting its pre-built server business as part of the company’s ongoing loss-cutting strategy.

Read more…

28 {{ "2023-07-28T00:00:00+00:00" | date "MMM" }} '23

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Interact Analysis News

Semiconductor slump challenges global manufacturing growth; a weak 2024 beckons

Interact Analysis’ recent update to its manufacturing industry output tracker report shows that China continues to prop up the manufacturing economy despite experiencing a rocky period of recovery.

Read more…

28 {{ "2023-07-28T00:00:00+00:00" | date "MMM" }} '23

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iBASE News

Power-Packed SI-624-AI Industrial AI Computer with NVIDIA Ampere MXM GPU

IBASE Technology Inc, showcases SI-624-AI industrial AI computer, winning Embedded Computing Design's Best in Show Award in Germany, showcasing exceptional performance and innovation in AI deep learning.

Read more…

28 {{ "2023-07-28T00:00:00+00:00" | date "MMM" }} '23

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Anritsu News

Anritsu selects COMPRION SIMplifier for fully automated mobile device testing

Anritsu Corporation integrates COMPRION SIMplifier hardware for automated GCF/PTCRB conformance and carrier acceptance testing, enhancing customer experience and speeding up testing.

Read more…

28 {{ "2023-07-28T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-07-28T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon presents highly integrated XENSIV 60 GHz radar sensor for consumer electronics, IoT applications, and healthcare devices

Infineon Technologies AG introduces the new XENSIV 60 GHz radar sensor BGT60UTR11AIP. With a compact size of only 16 mm², it is the smallest 60 GHz radar sensor with antennas in package (AIP) on the market and is specifically designed for integration into the smallest devices.

Read more…

28 {{ "2023-07-28T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-07-28T00:00:00+00:00" | date "longDate" }}

ANSYS News

ANSYS SIMULATION BOOSTS THE THERMAL RELIABILITY OF UPI’S POWER MANAGEMENT PRODUCTS BY 100%

uPI leverages Ansys’ multiphysics simulation tools to enhance the design, development, and verification of its chip package designs.

Read more…

27 {{ "2023-07-27T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-07-27T00:00:00+00:00" | date "longDate" }}

Solidrun News

High AI performance in a tiny, rugged housing

SolidRun launches new Bedrock R7000 - a Fanless Edge-AI IPC with AMD Ryzen 7840HS processor and 3 Hailo-8 AI Accelerators.

Read more…

27 {{ "2023-07-27T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-07-27T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon extends its PQFN 2x2 mm² product portfolio with best-in-class OptiMOS power MOSFETs

A small footprint of discrete power MOSFETs plays a critical role in achieving space savings, cost reduction, and easy-to-design applications.

Read more…

27 {{ "2023-07-27T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-07-27T00:00:00+00:00" | date "longDate" }}

Mouser News

Mouser introduces u-blox ZED-F9P-GNSS module for autonomous vehicles and robotics

The ZED-F9P GNSS module offers precise, centimeter-level industrial navigation with high update rates and low power consumption, making it ideal for dynamic applications like UAVs and robotics.

Read more…

27 {{ "2023-07-27T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-07-27T00:00:00+00:00" | date "longDate" }}

Panasonic Industry News

MESH NETWORKS AS EASY AS NEVER BEFORE

Panasonic Industry approached the Finnish mesh firmware innovators from Wirepas to integrate their patented advanced mesh connectivity into the PAN1780, a Bluetooth^® 5 Low Energy Module that is based on the Nordic Semiconductor’s nRF52840 single-chip controller.

Read more…

Technical Articles

What You Should Know About RFID Tags

Case studies

IDS: See. Align. Place

White Paper

Maximize Your Power System Efficiency — Download Our Whitepaper!

Intel Announces the NUC’s End-of-Life – Impulse Embedded can provide business continuity

Intel have recently announced that they will be exiting the business of complete PC systems, including NUC mini-PCs and kits. This follows the announcement from earlier in the year that Intel would be exiting its pre-built server business as part of the company’s ongoing loss-cutting strategy.

Semiconductor slump challenges global manufacturing growth; a weak 2024 beckons

Interact Analysis’ recent update to its manufacturing industry output tracker report shows that China continues to prop up the manufacturing economy despite experiencing a rocky period of recovery.

Power-Packed SI-624-AI Industrial AI Computer with NVIDIA Ampere MXM GPU

IBASE Technology Inc, showcases SI-624-AI industrial AI computer, winning Embedded Computing Design's Best in Show Award in Germany, showcasing exceptional performance and innovation in AI deep learning.

Anritsu selects COMPRION SIMplifier for fully automated mobile device testing

Anritsu Corporation integrates COMPRION SIMplifier hardware for automated GCF/PTCRB conformance and carrier acceptance testing, enhancing customer experience and speeding up testing.

Infineon presents highly integrated XENSIV 60 GHz radar sensor for consumer electronics, IoT applications, and healthcare devices

Infineon Technologies AG introduces the new XENSIV 60 GHz radar sensor BGT60UTR11AIP. With a compact size of only 16 mm², it is the smallest 60 GHz radar sensor with antennas in package (AIP) on the market and is specifically designed for integration into the smallest devices.

ANSYS SIMULATION BOOSTS THE THERMAL RELIABILITY OF UPI’S POWER MANAGEMENT PRODUCTS BY 100%

uPI leverages Ansys’ multiphysics simulation tools to enhance the design, development, and verification of its chip package designs.

High AI performance in a tiny, rugged housing

SolidRun launches new Bedrock R7000 - a Fanless Edge-AI IPC with AMD Ryzen 7840HS processor and 3 Hailo-8 AI Accelerators.

Infineon extends its PQFN 2x2 mm² product portfolio with best-in-class OptiMOS power MOSFETs

A small footprint of discrete power MOSFETs plays a critical role in achieving space savings, cost reduction, and easy-to-design applications.

Mouser introduces u-blox ZED-F9P-GNSS module for autonomous vehicles and robotics

The ZED-F9P GNSS module offers precise, centimeter-level industrial navigation with high update rates and low power consumption, making it ideal for dynamic applications like UAVs and robotics.

MESH NETWORKS AS EASY AS NEVER BEFORE

Panasonic Industry approached the Finnish mesh firmware innovators from Wirepas to integrate their patented advanced mesh connectivity into the PAN1780, a Bluetooth^® 5 Low Energy Module that is based on the Nordic Semiconductor’s nRF52840 single-chip controller.

International

Technical Articles

Case studies

White Paper

Intel have recently announced that they will be exiting the business of complete PC systems, including NUC mini-PCs and kits. This follows the announcement from earlier in the year that Intel would be exiting its pre-built server business as part of the company’s ongoing loss-cutting strategy.

Interact Analysis’ recent update to its manufacturing industry output tracker report shows that China continues to prop up the manufacturing economy despite experiencing a rocky period of recovery.

IBASE Technology Inc, showcases SI-624-AI industrial AI computer, winning Embedded Computing Design's Best in Show Award in Germany, showcasing exceptional performance and innovation in AI deep learning.

Anritsu Corporation integrates COMPRION SIMplifier hardware for automated GCF/PTCRB conformance and carrier acceptance testing, enhancing customer experience and speeding up testing.

Infineon Technologies AG introduces the new XENSIV 60 GHz radar sensor BGT60UTR11AIP. With a compact size of only 16 mm², it is the smallest 60 GHz radar sensor with antennas in package (AIP) on the market and is specifically designed for integration into the smallest devices.

uPI leverages Ansys’ multiphysics simulation tools to enhance the design, development, and verification of its chip package designs.

SolidRun launches new Bedrock R7000 - a Fanless Edge-AI IPC with AMD Ryzen 7840HS processor and 3 Hailo-8 AI Accelerators.

A small footprint of discrete power MOSFETs plays a critical role in achieving space savings, cost reduction, and easy-to-design applications.

The ZED-F9P GNSS module offers precise, centimeter-level industrial navigation with high update rates and low power consumption, making it ideal for dynamic applications like UAVs and robotics.

Panasonic Industry approached the Finnish mesh firmware innovators from Wirepas to integrate their patented advanced mesh connectivity into the PAN1780, a Bluetooth® 5 Low Energy Module that is based on the Nordic Semiconductor’s nRF52840 single-chip controller.

International

Panasonic Industry approached the Finnish mesh firmware innovators from Wirepas to integrate their patented advanced mesh connectivity into the PAN1780, a Bluetooth^® 5 Low Energy Module that is based on the Nordic Semiconductor’s nRF52840 single-chip controller.