STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and Soitec (Euronext Paris), a leader in designing and manufacturing innovative semiconductor materials, announce the next stage of their cooperation on Silicon Carbide (SiC) substrates, with the qualification of Soitec’s SiC substrate technology by ST planned over the next 18 months.
Anritsu Company has developed the new Compact Antenna Test Range (CATR) Anechoic Chamber 2 MA8172B configuration for its New Radio RF Conformance Test System ME7873NR to support 5G millimetre wave (mmWave) 2 Angle of Arrival (2 AoA) Radio Resource Management (RRM) tests.
Toroidal common mode chokes in THT from knitter-inductive complement the existing product portfolio to meet the requirements of the e-mobility market, among others. The main area of application is the suppression of EMC disturbances in 1- and 3- phase applications at nominal voltages of 230 V and 400 VAC.
Infineon Technologies AG in cooperation with 3D Time-of-Flight specialist and premium partner pmdtechnologies is introducing the IRS2975C imager sensor, a performance-push evolution of the IRS2875C.
Melexis launches the MLX92352, a universal programmable 3-axis latch & switch targeting relative position and speed sensing. It provides magnetic flexibility and pitch independent dual outputs that can be set as speed, pulse or direction.
Digi-Key Electronics, which offers the world’s largest selection of electronic components and automation products in stock for immediate shipment, has announced that it will match donations made to KiCad from Dec. 1-7, 2022, up to $15,000.
The MB-DIOx/y-IP65 module series in an IP65 housing with 2 or 4 digital inputs and 1 or 2 relay outputs is suitable for accommodating decentralized signal contacts and controlling decentralized switching tasks. As signal contacts, e.g. window contacts or the positions of ventilation flaps, etc. can be detected and controlled for switching tasks, e.g. motorized actuators or light bands, etc.
Mitsubishi Electric Corporation has announced that its new KD-CXF series of contact image sensors (CISs) equipped with the industry's deepest1 depth of field2 will launch this December beginning with the KD6R1064CXF-NL model. CISs are widely used in manufacturing to inspect product surfaces for scratches, dirt, miscoloring or mispositioning of printed labels, plastic film, etc.