Mitsubishi Electric Corporation announced that its new SLIMDIP-Z power semiconductor module, featuring an extra-high 30A rated current for use in inverter systems of home appliances, will be released in February 2023.
Aiming at Infineon’s latest AURIX TC4x the hardware support package for MathWorks Simulink® supports automotive engineers in designing advanced electric vehicles, sensor fusion, and radar signal processing functions, even before silicon is available. With the package, the designers can validate use cases, rapidly and automatically generate the embedded software, and test algorithms.
Congatec is pleased to announce that the PICMG COM-HPC technical subcommittee has approved the pinout and footprint of the new credit-card-sized (95x60mm) high-performance Computer-on-Module specification COM-HPC Mini.
TDK Corporation will showcase more than 30 technology demonstrations and experiences across its component and system solution portfolio for the entire spectrum of electronics applications at the 2023 Consumer Electronics Show (CES) in Las Vegas, Nevada, from January 5th through January 8th. Additionally, TDK plans to release multiple product and partner announcements for its InvenSense brand MEMS sensors throughout the week of the conference.
Moxa’s newly launched AIG-100 Series includes best-in-class IIoT gateways that help achieve your IIoT targets with the lowest total cost of ownership by focusing on distributed-energy-resource applications, especially in solar energy and energy storage systems.
Delta, announced it has been selected for the Dow Jones Sustainability Indices World Index for the 12th consecutive year, not only scoring the highest overall performance in the global electronic equipment industry for the 7th year in a row, but also with the 100th percentile for the environmental and social dimensions of the industry.
In recent years, DFI, the world leading brand in embedded motherboards and industrial computers, has actively implemented corporate sustainable management.
Panasonic Industry’s 6DoF inertial sensor series delivers precise information about the state and motion of a vehicle or machinery - and is already relied on in a wide field of motion applications.
SK hynix Inc. announced today that it has developed working samples of DDR51 Multiplexer Combined Ranks2 (MCR) Dual In-line Memory Module, the world’s fastest server DRAM product. The new product has been confirmed to operate at the data rate of minimum 8Gbps, and at least 80% faster than 4.8Gbps of the existing DDR5 products.