Tektronix, Inc. has announced details on the 2022 Tektronix Innovation Forum, offering engineers and scientists around the world 30+ classes on the latest technology trends, techniques, and test and measurement best practices for power, wireless, and high speed I/O. With the theme of “Accelerating Progress,” the 8+-hour free virtual global conference will from 14th June through to 29th June 2022, in eight global regions, including Europe, the Americas, China, Taiwan, India, ASEAN, Japan, and Korea.
Thalia Design Automation Ltd., provider of analog and mixed-signal circuit IP reuse platform, today announced its core Design Enabler product has been enhanced to significantly boost the value it brings to product development teams in both optimizing the performance of migrated designs and improving or preserving layout.
Diodes Incorporated has introduced two new multiplexer/demultiplexer linear ReDrivers, supporting the 20Gbps DisplayPort ultra-high bit rate transmission mode.The two devices are the industry’s first ReDrivers to address DisplayPort up to such high data rates.
Intel today recognized the contributions of its Vietnam site to alleviating constraints in the global semiconductor supply chain. Innovative approach to substrate processing in Vietnam enabled millions of additional units amid supply constraints.
Digi-Key’s upcoming webinar with SparkFun, Wurth Elektronik, HARTING and Analog Devices will provide insights on how to remotely monitor equipment with Single-Pair Ethernet (SPE). Event will feature experts from SparkFun, Würth Elektronik, HARTING and Analog Devices.
Vital to virtually every electronic application, electrical connectivity solutions transmit electrical current from an energy source to devices and equipment that use energy to perform a task.
Artificial Intelligence (AI) for wireless is already here, with applications in areas such as mobility management, sensing and localization, smart signaling, and interference management. Recently, Qualcomm Technologies prototyped the AI-enabled air interface and announced the Snapdragon X70 5G modem-RF, the world’s first 5G modem with a dedicated AI processor.
Siemens Digital Industries Software announced today availability of its leading Nucleus ReadyStart solution for embedded development targeting the fast-growing adoption of the RISC-V architecture.
The Contour2D sensor system enables optimally efficient detection of conveyor belt utilization. It is the only system on the market to require just one LiDAR sensor to do this.