30 {{ "2022-03-30T00:00:00+00:00" | date "MMM" }} '22

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Harwin News

HARWIN ADDS MORE SHIELDING OPTIONS FOR GECKO HI-REL CONNECTORS

Harwin has introduced horizontal backshells for its Gecko-Screw-Lok (Gecko-SL) series of lightweight, high-reliability (Hi-Rel) connectors. These backshells ensure a fully EMI/RFI shielded connection for horizontal 1.25mm pitch board-to-cable connections. Previously Gecko EMI/RFI shielding was only available on vertical board-to-cable orientations.

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30 {{ "2022-03-30T00:00:00+00:00" | date "MMM" }} '22

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Congatec News

CONGATEC INTRODUCES VEHICLE COMPUTING TECHNOLOGY FOR SMART MOBILITY AT INTERTRAFFIC AMSTERDAM

Congatec – a leading vendor of embedded and edge computing technology – is pleased to introduce new rugged vehicle computing platforms for smart mobility applications in the extended temperature range at Intertraffic Amsterdam, Hall 5/Booth 309.

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29 {{ "2022-03-29T00:00:00+00:00" | date "MMM" }} '22

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WM5G News

Deciphering Open RAN – Exploring the opportunities of open access connectivity in the 5G era

As connectivity is evolving, Open RAN (Radio Access Network) has rapidly become a hot topic for the 5G industry and the players within it.

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29 {{ "2022-03-29T00:00:00+00:00" | date "MMM" }} '22

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Digi-Key News

Digi-Key Electronics and Analog Devices to Host Webinar on New Edge Artificial Intelligence Use Cases

Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate shipment, will host a webinar in collaboration with Analog Devices, Inc.

Read more…

29 {{ "2022-03-29T00:00:00+00:00" | date "MMM" }} '22

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ST News

STMicroelectronics reveals 2.5V rad-hard digital-to-analog converter for next-generation satellite applications

The STMicroelectronics RHRDAC121 radiation-hardened digital-to-analog converter (DAC) operates down to 2.5V for use in modern, low-power system designs that older 3.3V parts cannot support.

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28 {{ "2022-03-28T00:00:00+00:00" | date "MMM" }} '22

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Nexperia News

Nexperia officially launches new Dallas design center

Nexperia today announced the official launch of its new design center in Dallas, Texas. Having recently celebrated its 5th anniversary as an independent company, this development marks another major step towards Nexperia’s stated goal of becoming a world leader in essential semiconductors by 2030. First R&D Facility in North America enables entry to power management IC market.

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28 {{ "2022-03-28T00:00:00+00:00" | date "MMM" }} '22

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Intel News

Intel Introduces New ATX PSU Specifications

Intel has published the most significant update to industry power supply specifications since the initial ATX 2.0 specs were introduced in 2003. Updated ATX 3.0 specifications unlock the full power and potential of next-generation hardware and upcoming components built for technologies like PCIe Gen 5.0.ATX 3.0 and ATX12VO 2.0 support next-generation hardware power demands.

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26 {{ "2022-03-26T00:00:00+00:00" | date "MMM" }} '22

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Rohm Semiconductors News

ROHM ESTABLISHES QUICUR: MAXIMIZING THE RESPONSE PERFORMANCE OF POWER SUPPLY ICS

Contributing to reducing power supply circuit design resources by providing stable operation with fewer external components.

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25 {{ "2022-03-25T00:00:00+00:00" | date "MMM" }} '22

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CEA Leti News

CEA and Startup C12 Join Forces to Develop Next-Generation Quantum Computers with Multi-Qubit Chips at Wafer Scale

CEA, a French key player in research, development and innovation, and C12 Quantum Electronics, a startup focused on developing the next-generation of quantum computers using carbon nanotubes, today announced a partnership to produce the first multi-qubit chips at wafer scale.

Read more…

25 {{ "2022-03-25T00:00:00+00:00" | date "MMM" }} '22

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Infineon News

Optimized CoolSiC MOSFETs 650 V in D²PAK for lowest losses in the application and highest reliability in operation

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) responds to these megatrends and resulting demands by offering a new family of CoolSiC 650 V silicon carbide (SiC) MOSFETs to deliver reliable, easy-to-use, and cost-effective top performance. Megatrends like digitalization, urbanization, and electromobility lead to increased power consumption. At the same time, energy efficiency is getting more and more important.

Read more…

Congatec – a leading vendor of embedded and edge computing technology – is pleased to introduce new rugged vehicle computing platforms for smart mobility applications in the extended temperature range at Intertraffic Amsterdam, Hall 5/Booth 309.

As connectivity is evolving, Open RAN (Radio Access Network) has rapidly become a hot topic for the 5G industry and the players within it.

Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate shipment, will host a webinar in collaboration with Analog Devices, Inc.

The STMicroelectronics RHRDAC121 radiation-hardened digital-to-analog converter (DAC) operates down to 2.5V for use in modern, low-power system designs that older 3.3V parts cannot support.

Contributing to reducing power supply circuit design resources by providing stable operation with fewer external components.

CEA, a French key player in research, development and innovation, and C12 Quantum Electronics, a startup focused on developing the next-generation of quantum computers using carbon nanotubes, today announced a partnership to produce the first multi-qubit chips at wafer scale.

International