01 {{ "2022-07-01T00:00:00+00:00" | date "MMM" }} '22

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Fischer Elektronik News

SMD HEATSINKS ON TAPE & REEL

The demands for efficient heat dissipation of electronic devices on the PCB have not been reduced. The increased complexity of the assemblies, as well as the combination of individual functional modules into one component, lead to an unwelcome and, in the long run, harmful power loss on the PCB, which is directly converted into heat.

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30 {{ "2022-06-30T00:00:00+00:00" | date "MMM" }} '22

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ST News

STMicroelectronics releases next-generation Bluetooth^® system-on-chip, enhanced with latest positioning capabilities

STMicroelectronics has introduced its third-generation Bluetooth^® System-on-Chip (SoC), enhanced with Bluetooth direction finding technology for location-tracking and real-time positioning applications.

Read more…

30 {{ "2022-06-30T00:00:00+00:00" | date "MMM" }} '22

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Intel News

Intel Foundry Services Forms Alliance to Enable Design in the Cloud

IFS Cloud Alliance harnesses the power of massive compute scalability to improve chip design efficiency and accelerate time-to-market for foundry customers.

Read more…

30 {{ "2022-06-30T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-06-30T00:00:00+00:00" | date "longDate" }}

Hitachi News

Hitachi High-Tech Launches the AFM100 Pro High-Sensitivity Scanning Probe Microscope System with Improved Detection Sensitivity

Pursuing improved sensitivity when measuring physical properties and measurement at atomic and molecular scales.

Read more…

30 {{ "2022-06-30T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-06-30T00:00:00+00:00" | date "longDate" }}

TDK News

Compact 250W 2 x 4 inch medical and industrial power supplies can be conduction or convection cooled

TDK Corporation announces the introduction of the 250W rated TDK-Lambda brand 2” x 4” footprint CUS250M series of AC-DC power supplies.

Read more…

30 {{ "2022-06-30T00:00:00+00:00" | date "MMM" }} '22

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Congatec News

AN ADVANCE INTO THE WORLD OF MIXED-CRITICAL REAL-TIME SERVERS

Congatec – a leading vendor of embedded and edge computing technology – extends its Intel Xeon D-2700 processor based Server-on-Module portfolio by launching five new modules in the compact (160x160mm) COM-HPC Server Size D performance class.

Read more…

29 {{ "2022-06-29T00:00:00+00:00" | date "MMM" }} '22

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Conrad News

Weidmüller Boost Network Security

Reliable internet connection: Weidmüller’s latest industrial security router is now available on the Conrad Sourcing Platform.

Read more…

29 {{ "2022-06-29T00:00:00+00:00" | date "MMM" }} '22

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Anritsu News

Anritsu Introduces Software to Expand IQ Measurement and Analysis Capabilities of Field Spectrum Analysis Solutions

Comprehensive Suite of Tools Aids Government Regulators, Security Agencies, Spectrum Owners, and Defense Electronics Companies to Better Analyze RF Signals.

Read more…

29 {{ "2022-06-29T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-06-29T00:00:00+00:00" | date "longDate" }}

Mouser News

Mouser Electronics and Diotec Semiconductor Announce Global Distribution Agreement

Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, announces a global distribution agreement with Diotec Semiconductor, designers and manufacturers of discrete semiconductor components.

Read more…

29 {{ "2022-06-29T00:00:00+00:00" | date "MMM" }} '22

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ANSYS News

Ansys and TSMC Collaborate to Deliver Multiphysics Design Methodology for Wireless Chips

Ansys platform supports TSMC’s N6RF Design Reference Flow to help enable faster and higher performance radio frequency chips for 5G, Wi-Fi, and IoT with TSMC’s N6RF process technology.

Read more…

Market Overview

Sustainability in Electronic Components: Eco-Friendly Materials and Recycling Initiatives

Technical Articles

Leakage Current Considerations for Medical Power Supplies

Case studies

Inspecting critical infrastructure with the help of intelligent drones

White Paper

Leakage Current Considerations for Medical Power Supplies

SMD HEATSINKS ON TAPE & REEL

STMicroelectronics releases next-generation Bluetooth^® system-on-chip, enhanced with latest positioning capabilities

STMicroelectronics has introduced its third-generation Bluetooth^® System-on-Chip (SoC), enhanced with Bluetooth direction finding technology for location-tracking and real-time positioning applications.

Intel Foundry Services Forms Alliance to Enable Design in the Cloud

IFS Cloud Alliance harnesses the power of massive compute scalability to improve chip design efficiency and accelerate time-to-market for foundry customers.

Hitachi High-Tech Launches the AFM100 Pro High-Sensitivity Scanning Probe Microscope System with Improved Detection Sensitivity

Pursuing improved sensitivity when measuring physical properties and measurement at atomic and molecular scales.

Compact 250W 2 x 4 inch medical and industrial power supplies can be conduction or convection cooled

TDK Corporation announces the introduction of the 250W rated TDK-Lambda brand 2” x 4” footprint CUS250M series of AC-DC power supplies.

AN ADVANCE INTO THE WORLD OF MIXED-CRITICAL REAL-TIME SERVERS

Congatec – a leading vendor of embedded and edge computing technology – extends its Intel Xeon D-2700 processor based Server-on-Module portfolio by launching five new modules in the compact (160x160mm) COM-HPC Server Size D performance class.

Weidmüller Boost Network Security

Reliable internet connection: Weidmüller’s latest industrial security router is now available on the Conrad Sourcing Platform.

Anritsu Introduces Software to Expand IQ Measurement and Analysis Capabilities of Field Spectrum Analysis Solutions

Comprehensive Suite of Tools Aids Government Regulators, Security Agencies, Spectrum Owners, and Defense Electronics Companies to Better Analyze RF Signals.

Mouser Electronics and Diotec Semiconductor Announce Global Distribution Agreement

Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, announces a global distribution agreement with Diotec Semiconductor, designers and manufacturers of discrete semiconductor components.

Ansys and TSMC Collaborate to Deliver Multiphysics Design Methodology for Wireless Chips

Ansys platform supports TSMC’s N6RF Design Reference Flow to help enable faster and higher performance radio frequency chips for 5G, Wi-Fi, and IoT with TSMC’s N6RF process technology.

International

Market Overview

Technical Articles

Case studies

White Paper

STMicroelectronics has introduced its third-generation Bluetooth® System-on-Chip (SoC), enhanced with Bluetooth direction finding technology for location-tracking and real-time positioning applications.

IFS Cloud Alliance harnesses the power of massive compute scalability to improve chip design efficiency and accelerate time-to-market for foundry customers.

Pursuing improved sensitivity when measuring physical properties and measurement at atomic and molecular scales.

TDK Corporation announces the introduction of the 250W rated TDK-Lambda brand 2” x 4” footprint CUS250M series of AC-DC power supplies.

Congatec – a leading vendor of embedded and edge computing technology – extends its Intel Xeon D-2700 processor based Server-on-Module portfolio by launching five new modules in the compact (160x160mm) COM-HPC Server Size D performance class.

Reliable internet connection: Weidmüller’s latest industrial security router is now available on the Conrad Sourcing Platform.

Comprehensive Suite of Tools Aids Government Regulators, Security Agencies, Spectrum Owners, and Defense Electronics Companies to Better Analyze RF Signals.

Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, announces a global distribution agreement with Diotec Semiconductor, designers and manufacturers of discrete semiconductor components.

Ansys platform supports TSMC’s N6RF Design Reference Flow to help enable faster and higher performance radio frequency chips for 5G, Wi-Fi, and IoT with TSMC’s N6RF process technology.

International

STMicroelectronics has introduced its third-generation Bluetooth^® System-on-Chip (SoC), enhanced with Bluetooth direction finding technology for location-tracking and real-time positioning applications.