16 {{ "2023-01-16T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-16T00:00:00+00:00" | date "longDate" }}

SK Hynix News

SK HYNIX OBTAINS INDUSTRY’S FIRST VALIDATION FOR 1ANM DDR5 DRAM ON THE 4TH GEN INTEL^® XEON^® SCALABLE PROCESSOR

The DDR5 product for servers using 1anm, the fourth generation of the 10nm process technology, has been validated on the 4th Gen Intel^® Xeon^® Scalable processor for the first time in the industry’s history.

Read more…

16 {{ "2023-01-16T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-16T00:00:00+00:00" | date "longDate" }}

Flex Power Modules News

Flex Power Modules’ BMR473 digital PoL regulator now available as SMD horizontal-mount version

The BMR473 digital non-isolated PoL converter from Flex Power Modules is now available in a surface-mount format with solder bump terminations. This new mechanical version is also suitable for reverse mounting during reflow-soldering.

Read more…

16 {{ "2023-01-16T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-16T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

KEYSIGHT ENABLES AETHERTEK TO VALIDATE THE PERFORMANCE OF 5G MILLIMETER WAVE OPEN RAN RADIO UNITS

Aethertek selected Keysight Open RAN Studio to test the end-to-end performance of its radio frequency front-end modules and millimeter wave phase array antennas.

Read more…

16 {{ "2023-01-16T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-16T00:00:00+00:00" | date "longDate" }}

ST News

STMICROELECTRONICS BRINGS 32-BIT KICK TO COST-SENSITIVE 8-BIT APPLICATIONS WITH STM32C0 SERIES MICROCONTROLLERS

Most affordable entry to STM32 family now in high-volume production and available for shipment, covered by ST’s 10-year longevity program.

Read more…

16 {{ "2023-01-16T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-16T00:00:00+00:00" | date "longDate" }}

innodisk

Drives Efficient Budget Control and AI Smart Applications

Innodisk is leading the way and launching new InnoEx Virtual I/O Expansion Module, which helps global industries efficiently deploy various AI smart applications through the integration of software and hardware using virtual I/O expansion technology.

Read more…

16 {{ "2023-01-16T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-16T00:00:00+00:00" | date "longDate" }}

Rutronik Info

High-temperature resistance meets miniaturization: Rubycon snap-in electrolytic capacitors at Rutronik

Rubycon complements the range of extremely compact components with guaranteed high-temperature resistance and long service life. This ranges from 3,000 (MXK), 5,000 (VXK), 7,000 (GXK) and 10,000 hours (NXK) at ambient temperatures up to 105 °C.

Read more…

16 {{ "2023-01-16T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-16T00:00:00+00:00" | date "longDate" }}

ASRockInd News

ASRock Industrial Releases Upgrades in Industrial Motherboards with 13th Gen Intel^® Core Processors

ASRock Industrial is pleased to introduce a range of upgrades in industrial motherboards powered by 13th Gen Intel^® Core Processors (Raptor Lake-S) with up to 24 cores and 32 threads, supporting Intel^® W680, Q670, and H610 chipsets.

Read more…

14 {{ "2023-01-14T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-14T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM appoints Aly Mashaly as new Director Application and Technical Solution Center in Europe

As of January 1st, Aly Mashaly has succeeded Günter Richard as Director of ROHM’s European Application and Technical Solution Center (ATSC). Günter Richard has retired after 32 years working for ROHM.

Read more…

14 {{ "2023-01-14T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-14T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas Introduces Low-Power RL78/G15 MCU with the Smallest 8-pin Package Option Available within the RL78 Family

Lower-pin Package Device Further Expands the RL78 Family with More Device Selection.

Read more…

14 {{ "2023-01-14T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-14T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon and Resonac announce the expansion of their cooperation and a new multi-year agreement for delivery of silicon carbide (SiC) materials

Infineon Technologies AG is extending its cooperation with silicon carbide (SiC) suppliers. The German-based semiconductor manufacturer has signed a new multi-year-supply and cooperation agreement with Resonac Corporation (formerly Showa Denko K.K.), complementing and expanding the announcement of 2021.

Read more…

Case studies

CompControl automates inbound electronics logistics with machine vision

SK HYNIX OBTAINS INDUSTRY’S FIRST VALIDATION FOR 1ANM DDR5 DRAM ON THE 4TH GEN INTEL^® XEON^® SCALABLE PROCESSOR

The DDR5 product for servers using 1anm, the fourth generation of the 10nm process technology, has been validated on the 4th Gen Intel^® Xeon^® Scalable processor for the first time in the industry’s history.

Flex Power Modules’ BMR473 digital PoL regulator now available as SMD horizontal-mount version

The BMR473 digital non-isolated PoL converter from Flex Power Modules is now available in a surface-mount format with solder bump terminations. This new mechanical version is also suitable for reverse mounting during reflow-soldering.

KEYSIGHT ENABLES AETHERTEK TO VALIDATE THE PERFORMANCE OF 5G MILLIMETER WAVE OPEN RAN RADIO UNITS

Aethertek selected Keysight Open RAN Studio to test the end-to-end performance of its radio frequency front-end modules and millimeter wave phase array antennas.

STMICROELECTRONICS BRINGS 32-BIT KICK TO COST-SENSITIVE 8-BIT APPLICATIONS WITH STM32C0 SERIES MICROCONTROLLERS

Most affordable entry to STM32 family now in high-volume production and available for shipment, covered by ST’s 10-year longevity program.

Drives Efficient Budget Control and AI Smart Applications

Innodisk is leading the way and launching new InnoEx Virtual I/O Expansion Module, which helps global industries efficiently deploy various AI smart applications through the integration of software and hardware using virtual I/O expansion technology.

High-temperature resistance meets miniaturization: Rubycon snap-in electrolytic capacitors at Rutronik

Rubycon complements the range of extremely compact components with guaranteed high-temperature resistance and long service life. This ranges from 3,000 (MXK), 5,000 (VXK), 7,000 (GXK) and 10,000 hours (NXK) at ambient temperatures up to 105 °C.

ASRock Industrial Releases Upgrades in Industrial Motherboards with 13th Gen Intel^® Core Processors

ASRock Industrial is pleased to introduce a range of upgrades in industrial motherboards powered by 13th Gen Intel^® Core Processors (Raptor Lake-S) with up to 24 cores and 32 threads, supporting Intel^® W680, Q670, and H610 chipsets.

ROHM appoints Aly Mashaly as new Director Application and Technical Solution Center in Europe

As of January 1st, Aly Mashaly has succeeded Günter Richard as Director of ROHM’s European Application and Technical Solution Center (ATSC). Günter Richard has retired after 32 years working for ROHM.

Renesas Introduces Low-Power RL78/G15 MCU with the Smallest 8-pin Package Option Available within the RL78 Family

Lower-pin Package Device Further Expands the RL78 Family with More Device Selection.

Infineon and Resonac announce the expansion of their cooperation and a new multi-year agreement for delivery of silicon carbide (SiC) materials

International

Case studies

The DDR5 product for servers using 1anm, the fourth generation of the 10nm process technology, has been validated on the 4th Gen Intel® Xeon® Scalable processor for the first time in the industry’s history.

The BMR473 digital non-isolated PoL converter from Flex Power Modules is now available in a surface-mount format with solder bump terminations. This new mechanical version is also suitable for reverse mounting during reflow-soldering.

Aethertek selected Keysight Open RAN Studio to test the end-to-end performance of its radio frequency front-end modules and millimeter wave phase array antennas.

Most affordable entry to STM32 family now in high-volume production and available for shipment, covered by ST’s 10-year longevity program.

Innodisk is leading the way and launching new InnoEx Virtual I/O Expansion Module, which helps global industries efficiently deploy various AI smart applications through the integration of software and hardware using virtual I/O expansion technology.

Rubycon complements the range of extremely compact components with guaranteed high-temperature resistance and long service life. This ranges from 3,000 (MXK), 5,000 (VXK), 7,000 (GXK) and 10,000 hours (NXK) at ambient temperatures up to 105 °C.

ASRock Industrial is pleased to introduce a range of upgrades in industrial motherboards powered by 13th Gen Intel® Core Processors (Raptor Lake-S) with up to 24 cores and 32 threads, supporting Intel® W680, Q670, and H610 chipsets.

As of January 1st, Aly Mashaly has succeeded Günter Richard as Director of ROHM’s European Application and Technical Solution Center (ATSC). Günter Richard has retired after 32 years working for ROHM.

Lower-pin Package Device Further Expands the RL78 Family with More Device Selection.

International

The DDR5 product for servers using 1anm, the fourth generation of the 10nm process technology, has been validated on the 4th Gen Intel^® Xeon^® Scalable processor for the first time in the industry’s history.

ASRock Industrial is pleased to introduce a range of upgrades in industrial motherboards powered by 13th Gen Intel^® Core Processors (Raptor Lake-S) with up to 24 cores and 32 threads, supporting Intel^® W680, Q670, and H610 chipsets.