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Lane Electronics News

BAE Systems honors Lane Electronics with a Silver Tier Supplier award

Lane Electronics today announced it received a Silver Tier Award for exceptional performance and contributions to supply chain success for BAE Systems, Inc.’s Electronic Systems sector. Lane Electronics was honored at a virtual ceremony and was selected from the pool of suppliers that worked with BAE Systems in 2021.

TDK News

TDK Ventures invests in XCOM Labs’ vision for a high-speed wireless future

TDK Corporation announced today that subsidiary TDK Ventures, Inc. has invested in wireless communications disruptor XCOM Labs to expedite the development of their 5G and wireless communications solutions, which emphasize bandwidth capacity, latency reduction/elimination, and compute load balancing.

Keysight technologies News

Keysight, FormFactor, DMPI and VDI Join Forces to Deliver a New 170 GHz / 220 GHz Broadband Vector Network Analysis Solution

Keysight, FormFactor, DMPI and VDI have jointly developed this new VNA solution to provide on-wafer millimeter-wave component characterization under various conditions. Enables customers to shorten design and verification cycles for 5G and emerging 6G applications.

Power Integrations News

Power Integrations Expands InnoSwitch4-CZ Integrated Switcher Family to 220 W

Power Integrations, the leader in high-voltage integrated circuits (ICs) for energy-efficient power conversion, today announced an expanded offering of the InnoSwitch4-CZ family of high-frequency, zero-voltage switching (ZVS) flyback controller ICs. When paired with Power Integrations' ClampZero active-clamp IC and, optionally, the recently announced HiperPFS-5 GaN-based power-factor corrector, the new ICs easily address the latest USB PD 3.1 specification for adapters and chargers up to 220 W.

NEC Corporation News

NEC provides AI-based traffic monitoring system with fiber-optic sensing technology for NEXCO CENTRAL

NEC Corporation has deployed an AI-based traffic monitoring system to Central Nippon Expressway Company Limited (NEXCO CENTRAL). The system uses fiber-optic sensing and AI technologies to visualize traffic conditions, such as the location, speed, and direction of travel, from vibrations produced by vehicle movement.

Telit News

Telit FN980 5G Module Approved for Use on NVIDIA Jetson AGX Orin Platform

Based on the 3GPP Rel. 15 standard, the FN980 is ideal for high-performance and bandwidth-intensive applications enabled by NVIDIA Jetson AGX Orin—the world’s most powerful, compact and energy-efficient AI supercomputer built for advanced robotics and autonomous machines, as well as edge computing.

Intel News

12th Gen Intel Core Powers New Framework Laptops

Framework has announced that its newest generation Framework Laptops – powered by the latest 12th Gen Intel® Core P-series processors – are available for pre-order. Framework’s 2nd generation systems feature up to 12th Gen Intel Core i7-1280P processors.

TDK News

TDK offers PhaseCap® Energy Plus PFC capacitors with significantly improved performance

TDK Corporation introduces PhaseCap® Energy Plus, two new series of EPCOS PFC capacitors. The B25674C* series is gas-impregnated and covers a voltage range from 230 V AC to 690 V AC and offers compensation ratings from 5 kvar to 33.1 kvar, depending on the type. The B25675C* series capacitors are impregnated with a biodegradable resin and are rated for voltages from 230 V AC to 1000 V AC, with compensation ratings of up to 60 kvar.

Mediatek News

MediaTek Launches First mmWave Chipset for Seamless 5G Smartphone Connectivity

MediaTek today announced the Dimensity 1050 system-on-chip [SoC], its first mmWave 5G chipset that will power the next generation of 5G smartphones with seamless connectivity, displays, gaming and power efficiency. Through dual connectivity using mmWave and sub-6GHz, the Dimensity 1050 will deliver the speeds and capacity required to provide smartphone users with an incredible experience, even in some of the most densely populated areas.

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