BV Elektronik, an Avnet company, will exhibit at embedded world, the leading trade fair for the embedded community, from 21 – 23 June 2022 in Nuremberg, Germany. The distributor is using the event to demonstrate its expertise across a dozen dedicated workstations that integrate content from a total of 19 different suppliers and partners.
Exxelia, a global manufacturer of complex passive components and subsystems for harsh environments, is expanding its CUBISIC capacitor range with a HTLP (High Temperature Low Profile) version. This CUBISIC HTLP offers, in a thin rectangular packaging, the highest energy density of capacitors in its class, combined with a high temperature resistance (-55° +125°C).
Tektronix, Inc. today unveiled the 2 Series Mixed Signal Oscilloscope (MSO), reimagining what is possible in test and measurement. The new 2 Series MSO can go seamlessly from the bench to the field and back, enabling workflows previously unimagined on a scope.
CUI Devices’ Motion Group today announced the introduction of a new series to its AMT incremental encoder family. Based on the existing AMT11 series package, the new AMT11A series is not subject to silicon related lead time constraints and can serve as a drop-in replacement for AMT11 encoder models. AMT11A encoders offer 16 quadrature resolutions from 96 to 4096 PPR, selectable via an on-board DIP switch.
Economical and ultra-slim design fulfills auxiliary power needs for wall-mounted EV charging points. TTI, Inc., a leading specialty distributor of electronic components, is now stocking the HDR-30 and HDR-60 series of DIN rails AC/DC power from Mean Well.
Toshiba Electronic Devices & Storage Corporation ("Toshiba") has added five products to its lineup of MOSFET gate driver ICs in the TCK42xG Series for mobile devices such as wearables. The new products in the series are equipped with an overvoltage lockout function and control the gate voltage of an external MOSFET according to the input voltage.
Intel’s latest security innovations – cutting-edge product capabilities, demos and real-world use cases – were in the spotlight throughout RSA Conference. At RSA Conference this week in San Francisco, Intel reinforced its commitment to security. At the event, leaders from Intel and its ecosystem partners came together to discuss how the company is addressing some of the toughest security challenges, including hybrid workforces and an increase in connected devices.
Qualcomm Technologies, Inc. today announced the company’s relationship with PATEO CONNECT+ (hereinafter referred to as “PATEO”) in the automotive intelligent cockpit field.
The STMicroelectronics TSB622 general-purpose low-power dual operational amplifier (op amp) enhances ruggedness and flexibility in industrial and automotive applications.
Industrial camera manufacturer IDS Imaging Development Systems GmbH celebrates its 25th anniversary. The owner-managed family business from Obersulm in Germany continues to go its own way. As a pioneer in the field of digital image processing, the company, led by founder and managing director Jürgen Hartmann, wants to continue to make it easier for its customers to use future technologies in the coming years - in line with the company's own motto "It's so easy".