10
'21
Written on
Renesas News
10
'21
Written on
Microchip News
Microchip to Provide Silicon Carbide MOSFETs and Digital Gate Drivers for Mersen’s SiC Power Stack Reference Design
Electric vehicle, commercial transportation, renewable energy and storage system designers can benefit from silicon carbide stack solution that drives performance and cost efficiencies and accelerates time to market by up to six months.
10
'21
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Inelta News
The smallest LVDT with probe function in the world – from Inelta
Inelta is expanding its range of miniaturized displacement sensors for medical, laboratory and testing technology with the world’s smallest LVDT with a probe function: the LVDT of the IFAT series has an outer diameter of only 6 mm and is designed for the highly accurate detection of measurement ranges between 2.5 mm and 10 mm.
10
'21
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CK Switches News
Versatile IP67 Sealed Interlock Solution for Supports Rugged AC or DC Applications
Whether used indoors or outdoors, the reliable SL Series snap switch endures harsh environment conditions…
10
'21
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Infineon News
Infineon's 5th Generation CAPSENSE technology extends market leadership with improved robustness, reliability and lower power consumption
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today launched the company’s fifth-generation CAPSENSE capacitive and inductive touch sensing human-machine interface (HMI) technology.
10
'21
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Sivers Semiconductors News
Sivers Semiconductors delivers proof point of its world leading 5G mmWave technology in collaboration with Rohde & Schwarz
Sivers Semiconductors AB today announced that its subsidiary Sivers Wireless has partnered with Rohde & Schwarz, a market-leading supplier of test and measurement solutions for Radio Frequency (RF) components and the wireless industry, to test the performance of Sivers Semiconductors state-of-art Radio Frequency Integrated Circuit (RFIC) TRXBF01.
10
'21
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TDK News
THERMISTORS: TDK OFFERS HIGH-PRECISION NTC CHIPS FOR EMBEDDING INTO IGBT MODULES
TDK Corporation (TSE:6762) presents the new L860 NTC thermistor chip which can be directly embedded into power modules and used within sintering and AI-heavy wire bonding. Its characteristics correspond to the common MELF-R/T curve with R100 of 493 Ω. The lead-free chip with ordering code B57860L0522J500 is designed for a wide temperature range of -55 °C to +175 °C, has dimensions of 1.6 x 1.6 x 0.5 mm.
09
'21
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Renesas News
Renesas Programmable Smart Gate Driver for BLDC Motor Applications Drives Multiple Configurations; Integrates Analog Power Components to Reduce BOM Cost and Board Space
The RAA227063 Pairs with a Variety of MCUs to Deliver Efficient, Flexible Motor Control in a Smaller Footprint; New Winning Combo Showcases the Device with Renesas’ New RA6T2 MCU.
09
'21
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Mouser News
Mouser Electronics Now Distributing Fujitsu Semiconductor Memory Solution Products
Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, proudly announces that it now distributes ferroelectric random access memory (FRAM) and large-density resistive random access memory (ReRAM) products from Fujitsu Semiconductor Memory Solution.
09
'21
Written on
Toshiba News
