Sivers Semiconductors today announces the launch of multiple new products from the recently completed MixComm acquisition including 2nd generation beamformers, frequency converters, high-end fixed wireless access module.
The funding round, which includes current investors Parkwalk and Amadeus, will enable the business to increase its technological capacity globally and enhance its R&D capabilities.
KREEMO and Sivers Semiconductors announced that they had succeeded in developing the world’s first high performance 5G module with a 360o coverage for metaverse at MWC 2022.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and a top manufacturer of micro-electro-mechanical systems (MEMS), is introducing its third generation of MEMS sensors.
NTT DOCOMO, INC. (DOCOMO) and NEC Corporation (NEC) have launched a proof-of-concept (PoC) testing to run NEC's 5G core network (5GC) service in a hybrid cloud environment that leverages the Amazon Web Services (AWS) cloud using end-to-end cloud-native network architecture.
MediaTek inc. and Anritsu Corporation are pleased to announce that the first DAPS handover for 5G New Radio (NR) has been verified with a device containing the MediaTek M80 5G modem and Anritsu’s MT8000A Radio Communication Test Station with Rapid Test Designer (RTD) application software.
TDK Corporation (TSE 6762) announces the introduction of 20U high, 19-inch rack cabinet high power solutions to the TDK-Lambda GENESYS+ series of programmable DC power supplies.
Transfer Multisort Elektronik (TME) continues to expand the variety of applications it is able to address by adding to the range of products available through its distribution network.