15 {{ "2021-12-15T00:00:00+00:00" | date "MMM" }} '21

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Binder News

SUBMINIATURE CONNECTORS MEET HIGHEST DEMANDS ON PROTECTION AND FLEXIBILITY

The compact and highly flexible circular connectors of binder's 670 series withstand demanding protection requirements. Rated as particularly innovative among more than 100 products, they have now received a prestigious award.

Read more…

15 {{ "2021-12-15T00:00:00+00:00" | date "MMM" }} '21

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Renesas News

Renesas Introduces Second-Generation of ClockMatrix Family of Network Synchronizers and Jitter Attenuators for Optical and Wireline Networks

New ClockMatrix 2 Delivers Industry’s First Single Chip Network Synchronizer and Jitter Attenuator with Ultra-Low Jitter Clock Outputs While Supporting all IEEE1588 operating modes.

Read more…

15 {{ "2021-12-15T00:00:00+00:00" | date "MMM" }} '21

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Infineon News

Infineon expands wireless portfolio to support Matter with multiprotocol solutions including Bluetooth LE and 802.15.4 low-power SoC for smart homes

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the launch of the new AIROC Bluetooth^® LE and 802.15.4 family to help companies quickly bring low-power, high-performing Matter products to market.

Read more…

15 {{ "2021-12-15T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-15T00:00:00+00:00" | date "longDate" }}

iSYSTEM News

Risk-free debugging with iSYSTEM Galvanic Isolation Adapters

Preventing personal injury and electrical damage to both development equipment and target.

Read more…

15 {{ "2021-12-15T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-15T00:00:00+00:00" | date "longDate" }}

Omniflex News

All-in-one solutions help deliver ongoing operational efficiency

Why industry should look to fully integrated all-in-one monitoring and control systems.

Read more…

15 {{ "2021-12-15T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-15T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas Develops Write Technologies for Embedded STT-MRAM Significantly Reducing MCUs Power Consumption in IoT Applications

Announced at IEDM 2021: Confirmed Reduced Power Consumption and Increased Speed in Write Operations on 16 nm FinFET Logic Process Embedded STT-MRAM Test Chip.

Read more…

15 {{ "2021-12-15T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-15T00:00:00+00:00" | date "longDate" }}

innodisk

Innodisk Releases the World’s First 10GbE LAN Module in M.2 Form Factor

Innodisk has announced its all-new EGPL-T101 M.2 2280 10GbE LAN module, the first 10GbE LAN designed in M.2 form factor, features flexible integration and excellent compatibility with existing network infrastructure for crucial backward compatibility

Read more…

15 {{ "2021-12-15T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-15T00:00:00+00:00" | date "longDate" }}

Moxa

Moxa Demonstrates Game-changing Solution for Next-level Time-sensitive Networking

Joint Collaboration Between Moxa, Intel, and port industrial automation GmbH to Advance Deterministic Network Communication Over Standard Ethernet.

Read more…

15 {{ "2021-12-15T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-12-15T00:00:00+00:00" | date "longDate" }}

Acceed News

Slim industry switch with 8 RJ45 + 2 SFP

A switch must always be affordable and easy to install if high port density is required in extended industrial centres. Robust design for the highest possible permissible ambient temperatures during operation is a further factor in favour of enabling rail mounting and the installation of several switches in switch boxes.

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14 {{ "2021-12-14T00:00:00+00:00" | date "MMM" }} '21

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TDK News

TDK OFFERS HYBRID POLYMER CAPACITORS WITH CONSIDERABLY ENHANCED RIPPLE CURRENT CAPABILITY

TDK Corporation (TSE: 6762) presents with the B40640B* and B40740B* series hybrid polymer capacitors with a very high ripple current capability increased by up to 29 per cent compared to preceding types.

Read more…

Technical Articles

Satellite monitoring systems for real-time RF intelligence

Case studies

Cold, clever, convenient – Früchte Jork puts new deep-freeze warehouse into operation

SUBMINIATURE CONNECTORS MEET HIGHEST DEMANDS ON PROTECTION AND FLEXIBILITY

The compact and highly flexible circular connectors of binder's 670 series withstand demanding protection requirements. Rated as particularly innovative among more than 100 products, they have now received a prestigious award.

Renesas Introduces Second-Generation of ClockMatrix Family of Network Synchronizers and Jitter Attenuators for Optical and Wireline Networks

New ClockMatrix 2 Delivers Industry’s First Single Chip Network Synchronizer and Jitter Attenuator with Ultra-Low Jitter Clock Outputs While Supporting all IEEE1588 operating modes.

Infineon expands wireless portfolio to support Matter with multiprotocol solutions including Bluetooth LE and 802.15.4 low-power SoC for smart homes

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the launch of the new AIROC Bluetooth^® LE and 802.15.4 family to help companies quickly bring low-power, high-performing Matter products to market.

Risk-free debugging with iSYSTEM Galvanic Isolation Adapters

Preventing personal injury and electrical damage to both development equipment and target.

All-in-one solutions help deliver ongoing operational efficiency

Why industry should look to fully integrated all-in-one monitoring and control systems.

Renesas Develops Write Technologies for Embedded STT-MRAM Significantly Reducing MCUs Power Consumption in IoT Applications

Announced at IEDM 2021: Confirmed Reduced Power Consumption and Increased Speed in Write Operations on 16 nm FinFET Logic Process Embedded STT-MRAM Test Chip.

Innodisk Releases the World’s First 10GbE LAN Module in M.2 Form Factor

Innodisk has announced its all-new EGPL-T101 M.2 2280 10GbE LAN module, the first 10GbE LAN designed in M.2 form factor, features flexible integration and excellent compatibility with existing network infrastructure for crucial backward compatibility

Moxa Demonstrates Game-changing Solution for Next-level Time-sensitive Networking

Joint Collaboration Between Moxa, Intel, and port industrial automation GmbH to Advance Deterministic Network Communication Over Standard Ethernet.

Slim industry switch with 8 RJ45 + 2 SFP

TDK OFFERS HYBRID POLYMER CAPACITORS WITH CONSIDERABLY ENHANCED RIPPLE CURRENT CAPABILITY

TDK Corporation (TSE: 6762) presents with the B40640B* and B40740B* series hybrid polymer capacitors with a very high ripple current capability increased by up to 29 per cent compared to preceding types.

International

Technical Articles

Case studies

The compact and highly flexible circular connectors of binder's 670 series withstand demanding protection requirements. Rated as particularly innovative among more than 100 products, they have now received a prestigious award.

New ClockMatrix 2 Delivers Industry’s First Single Chip Network Synchronizer and Jitter Attenuator with Ultra-Low Jitter Clock Outputs While Supporting all IEEE1588 operating modes.

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the launch of the new AIROC Bluetooth® LE and 802.15.4 family to help companies quickly bring low-power, high-performing Matter products to market.

Preventing personal injury and electrical damage to both development equipment and target.

Why industry should look to fully integrated all-in-one monitoring and control systems.

Announced at IEDM 2021: Confirmed Reduced Power Consumption and Increased Speed in Write Operations on 16 nm FinFET Logic Process Embedded STT-MRAM Test Chip.

Innodisk has announced its all-new EGPL-T101 M.2 2280 10GbE LAN module, the first 10GbE LAN designed in M.2 form factor, features flexible integration and excellent compatibility with existing network infrastructure for crucial backward compatibility

Joint Collaboration Between Moxa, Intel, and port industrial automation GmbH to Advance Deterministic Network Communication Over Standard Ethernet.

TDK Corporation (TSE: 6762) presents with the B40640B* and B40740B* series hybrid polymer capacitors with a very high ripple current capability increased by up to 29 per cent compared to preceding types.

International

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the launch of the new AIROC Bluetooth^® LE and 802.15.4 family to help companies quickly bring low-power, high-performing Matter products to market.