14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-14T00:00:00+00:00" | date "longDate" }}

Congatec News

NEW ULTRA-RUGGED 11TH GEN INTEL^® CORE^® CONGATEC MODULES WITH SOLDERED RAM

Congatec – a leading vendor of embedded and edge computing technology – introduces new 11th Gen Intel^® Core^® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

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LEMO

Standard self-latching multipole connectors with alignment key

The LEMO B Series offers a modular, ergonomic, rugged and reliable circular multipole connector for applications needing quick and secure Push-Pull latching. Making it an ideal choice for test and measurement, instrumentation, medical devices, research and audio/video applications.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-14T00:00:00+00:00" | date "longDate" }}

CUI devices News

60 W Power-Only USB Type C Receptacle Features Vertical Orientation

CUI Devices’ Interconnect Group announced the continued expansion of their power-only USB Type C receptacle line with the introduction of a vertically-oriented model.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

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MIkroe News

MIKROE’s universal FUSION development board for all Microchip PIC microcontrollers ‘equipped with everything developers need’

FUSION for PIC v8 includes Wi-Fi debugging, Click peripheral sockets, SiBRAIN MCU sockets plus display options.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-14T00:00:00+00:00" | date "longDate" }}

NEC Corporation News

Microsoft and NEC Expand Strategic Partnership to Boost Business Resiliency and Growth

Microsoft Corp. (Microsoft) and NEC Corporation (NEC; TSE: 6701) on Tuesday announced an expansion of their decades-long collaboration.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-14T00:00:00+00:00" | date "longDate" }}

Anritsu News

Supporting 6 GHz Frequency Band Measurements for Wireless communication device Production Lines

MT8870A/MT8872A supports IEEE 802.11ax and NR-U 6 GHz band.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

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Keysight technologies News

Keysight’s Test Solutions Selected by DEKRA to Verify 5G, Wi-Fi and Bluetooth Devices in Compliance to Regulatory Standards

Global test house expands use of Keysight’s test platforms to address growing adoption of 5G and IoT.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-14T00:00:00+00:00" | date "longDate" }}

Telit News

Telit FN980 Certified for Use on T-Mobile’s 5G Network

Businesses and original equipment manufacturers (OEMs) are now able to leverage the FN980 for high-performance, bandwidth-intensive applications on T-Mobile’s 5G network.

Read more…

13 {{ "2021-07-13T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-13T00:00:00+00:00" | date "longDate" }}

IDS Imaging Development Systems GmbH

Fizyr, MVTec and urobots with sessions at the 3-in-1 focus event on July 20th from 2 p.m. BST

Robot-based automation: experts explain "Intelligent Pick & Place" in the IDS Vision Channel

Read more…

13 {{ "2021-07-13T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-13T00:00:00+00:00" | date "longDate" }}

SK Hynix News

SK hynix Starts Mass Production of 1anm DRAM Using EUV Equipment

SK hynix Inc. (or “the Company”, www.skhynix.com) announced that it has started this month mass production of the 8 Gigabit (Gb) *LPDDR4 mobile DRAM based on the 1anm, which is the fourth generation of the 10nm process technology.

Read more…

Technical Articles

TDK expands YFF Series filters to meet growing automotive safety demands

Case studies

IDS: Event-Based Cameras Enhance Flow Measurement in Science and Industry

White Paper

Parallel Operation of Power Supplies with User Systems

NEW ULTRA-RUGGED 11TH GEN INTEL^® CORE^® CONGATEC MODULES WITH SOLDERED RAM

Congatec – a leading vendor of embedded and edge computing technology – introduces new 11th Gen Intel^® Core^® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance.

Standard self-latching multipole connectors with alignment key

The LEMO B Series offers a modular, ergonomic, rugged and reliable circular multipole connector for applications needing quick and secure Push-Pull latching. Making it an ideal choice for test and measurement, instrumentation, medical devices, research and audio/video applications.

60 W Power-Only USB Type C Receptacle Features Vertical Orientation

CUI Devices’ Interconnect Group announced the continued expansion of their power-only USB Type C receptacle line with the introduction of a vertically-oriented model.

MIKROE’s universal FUSION development board for all Microchip PIC microcontrollers ‘equipped with everything developers need’

FUSION for PIC v8 includes Wi-Fi debugging, Click peripheral sockets, SiBRAIN MCU sockets plus display options.

Microsoft and NEC Expand Strategic Partnership to Boost Business Resiliency and Growth

Microsoft Corp. (Microsoft) and NEC Corporation (NEC; TSE: 6701) on Tuesday announced an expansion of their decades-long collaboration.

Supporting 6 GHz Frequency Band Measurements for Wireless communication device Production Lines

MT8870A/MT8872A supports IEEE 802.11ax and NR-U 6 GHz band.

Keysight’s Test Solutions Selected by DEKRA to Verify 5G, Wi-Fi and Bluetooth Devices in Compliance to Regulatory Standards

Global test house expands use of Keysight’s test platforms to address growing adoption of 5G and IoT.

Telit FN980 Certified for Use on T-Mobile’s 5G Network

Businesses and original equipment manufacturers (OEMs) are now able to leverage the FN980 for high-performance, bandwidth-intensive applications on T-Mobile’s 5G network.

Fizyr, MVTec and urobots with sessions at the 3-in-1 focus event on July 20th from 2 p.m. BST

Robot-based automation: experts explain "Intelligent Pick & Place" in the IDS Vision Channel

SK hynix Starts Mass Production of 1anm DRAM Using EUV Equipment

SK hynix Inc. (or “the Company”, www.skhynix.com) announced that it has started this month mass production of the 8 Gigabit (Gb) *LPDDR4 mobile DRAM based on the 1anm, which is the fourth generation of the 10nm process technology.

International

Technical Articles

Case studies

White Paper

Congatec – a leading vendor of embedded and edge computing technology – introduces new 11th Gen Intel® Core® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance.

The LEMO B Series offers a modular, ergonomic, rugged and reliable circular multipole connector for applications needing quick and secure Push-Pull latching. Making it an ideal choice for test and measurement, instrumentation, medical devices, research and audio/video applications.

CUI Devices’ Interconnect Group announced the continued expansion of their power-only USB Type C receptacle line with the introduction of a vertically-oriented model.

FUSION for PIC v8 includes Wi-Fi debugging, Click peripheral sockets, SiBRAIN MCU sockets plus display options.

Microsoft Corp. (Microsoft) and NEC Corporation (NEC; TSE: 6701) on Tuesday announced an expansion of their decades-long collaboration.

MT8870A/MT8872A supports IEEE 802.11ax and NR-U 6 GHz band.

Global test house expands use of Keysight’s test platforms to address growing adoption of 5G and IoT.

Businesses and original equipment manufacturers (OEMs) are now able to leverage the FN980 for high-performance, bandwidth-intensive applications on T-Mobile’s 5G network.

Robot-based automation: experts explain "Intelligent Pick & Place" in the IDS Vision Channel

SK hynix Inc. (or “the Company”, www.skhynix.com) announced that it has started this month mass production of the 8 Gigabit (Gb) *LPDDR4 mobile DRAM based on the 1anm, which is the fourth generation of the 10nm process technology.

International

Congatec – a leading vendor of embedded and edge computing technology – introduces new 11th Gen Intel^® Core^® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance.