28 {{ "2021-05-28T00:00:00+00:00" | date "MMM" }} '21

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Cadence News

Cadence Unleashes Clarity 3D Solver on the Cloud for Straightforward, Secure and Scalable Electromagnetic Analysis of Complex Systems on AWS

Clarity 3D Solver Cloud integrates on-premises simulation setup with cloud computation and acceleration at no additional cost.

Read more…

28 {{ "2021-05-28T00:00:00+00:00" | date "MMM" }} '21

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Nexcom News

Versatile Display Solution NDiS B360 Lifts Visual Experiences to New Heights

As COVID-19 took the globe by storm in the past year, the pace of digital transformation has accelerated and become even more pervasive.

Read more…

28 {{ "2021-05-28T00:00:00+00:00" | date "MMM" }} '21

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Nexperia News

Low RDS(on) 40 V MOSFETs from Nexperia deliver highest power density for Automotive and Industrial applications

Low RDS(on) 40 V MOSFETs from Nexperia deliver highest power density for Automotive and Industrial applications.

Read more…

28 {{ "2021-05-28T00:00:00+00:00" | date "MMM" }} '21

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Telit News

Interoperability Testing Unlocks Commercialization of Telit’s FN980m 5G Module in Russia

Telit, a global enabler of the Internet of Things (IoT), today announced its FN980m 5G module is ready for mass deployment in Russia after successful testing with all major radio access network (RAN) vendors and mobile network operators (MNOs).

Read more…

28 {{ "2021-05-28T00:00:00+00:00" | date "MMM" }} '21

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Renesas News

Renesas Expands Portfolio of World’s Smallest Photocouplers for Industrial Automation and Solar Inverter Applications

New 8.2mm Creepage IGBT Drivers and IPM Driver Reduce PCB Mounting Area by 35 Percent to Maximize Board Space.

Read more…

28 {{ "2021-05-28T00:00:00+00:00" | date "MMM" }} '21

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ST News

Magic Information Launches Turnkey Solution for Smart Locks Using Technology from STMicroelectronics

Magic Information, China’s leading Artificial Intelligence of Things (AIoT) fingerprint-recognition technology provider, has launched a smart-lock reference design, based on AIoT fingerprint recognition running on an STMicroelectronics STM32WB55* Bluetooth^® LE (BLE) microcontroller (MCU) that manufacturers can integrate into their designs to make Smart Locks.

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28 {{ "2021-05-28T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-05-28T00:00:00+00:00" | date "longDate" }}

Mouser News

Mouser Electronics Examines Power Management in Latest from Empowering Innovation Together Series

EE Raymond Yin and Steven Shackell Discuss Growth of GaN and SiC Market.

Read more…

28 {{ "2021-05-28T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-05-28T00:00:00+00:00" | date "longDate" }}

Carlo Gavazzi News

THE NEW NRG DIGITAL SOLID STATE RELAYS WITH PHASE ANGLE AND SOFT START SWITCHING

Increased versatility with the addition of new switching capabilities.

Read more…

28 {{ "2021-05-28T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-05-28T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba Releases Photovoltaic-output Photocoupler for Isolated Solid State Relays

High open voltage contributes to driving high-voltage power MOSFETs.

Read more…

28 {{ "2021-05-28T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-05-28T00:00:00+00:00" | date "longDate" }}

Cadence News

Cadence Collaborates with TSMC to Accelerate Mobile, AI and Hyperscale Computing Application Development on N3 and N4 Processes

Joint customers successfully use the certified Cadence digital flow and custom/analog tool suite to complete test chip tapeouts on TSMC’s advanced processes.

Read more…

Case studies

Delta Powers Europe’s Largest Solar Park with 3,500 High-Efficiency Inverters

Cadence Unleashes Clarity 3D Solver on the Cloud for Straightforward, Secure and Scalable Electromagnetic Analysis of Complex Systems on AWS

Clarity 3D Solver Cloud integrates on-premises simulation setup with cloud computation and acceleration at no additional cost.

Versatile Display Solution NDiS B360 Lifts Visual Experiences to New Heights

As COVID-19 took the globe by storm in the past year, the pace of digital transformation has accelerated and become even more pervasive.

Low RDS(on) 40 V MOSFETs from Nexperia deliver highest power density for Automotive and Industrial applications

Low RDS(on) 40 V MOSFETs from Nexperia deliver highest power density for Automotive and Industrial applications.

Interoperability Testing Unlocks Commercialization of Telit’s FN980m 5G Module in Russia

Telit, a global enabler of the Internet of Things (IoT), today announced its FN980m 5G module is ready for mass deployment in Russia after successful testing with all major radio access network (RAN) vendors and mobile network operators (MNOs).

Renesas Expands Portfolio of World’s Smallest Photocouplers for Industrial Automation and Solar Inverter Applications

New 8.2mm Creepage IGBT Drivers and IPM Driver Reduce PCB Mounting Area by 35 Percent to Maximize Board Space.

Magic Information Launches Turnkey Solution for Smart Locks Using Technology from STMicroelectronics

Mouser Electronics Examines Power Management in Latest from Empowering Innovation Together Series

EE Raymond Yin and Steven Shackell Discuss Growth of GaN and SiC Market.

THE NEW NRG DIGITAL SOLID STATE RELAYS WITH PHASE ANGLE AND SOFT START SWITCHING

Increased versatility with the addition of new switching capabilities.

Toshiba Releases Photovoltaic-output Photocoupler for Isolated Solid State Relays

High open voltage contributes to driving high-voltage power MOSFETs.

Cadence Collaborates with TSMC to Accelerate Mobile, AI and Hyperscale Computing Application Development on N3 and N4 Processes

Joint customers successfully use the certified Cadence digital flow and custom/analog tool suite to complete test chip tapeouts on TSMC’s advanced processes.

International