06 {{ "2021-07-06T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-06T00:00:00+00:00" | date "longDate" }}

Intel News

The Revolutions that Led to Chips Made Like Quilts

‘Behind the Builders:’ Intel Fellow Ravi Mahajan found packaging technologies were improving on a disturbingly straight line, inspiring an approach that was simple in concept but hard to pull off.

Read more…

06 {{ "2021-07-06T00:00:00+00:00" | date "MMM" }} '21

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Nexperia News

Nexperia obtains 100% ownership of Newport Wafer Fab, to be renamed Nexperia Newport

Welsh semiconductor plant to focus on MOSFETs, IGBT, Analog and Compound Semiconductor Automotive-grade products.

Read more…

06 {{ "2021-07-06T00:00:00+00:00" | date "MMM" }} '21

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Souriau News

Souriau 8STA high performance, harsh environment, circular connectors from Lane Electronics

Lane Electronics, a leading franchised distributor for many of the industry’s major electrical and electronic connector manufacturers, are an added value “assembling distributor” for Eaton’s high performance Souriau8STA circular connectors .

Read more…

05 {{ "2021-07-05T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-05T00:00:00+00:00" | date "longDate" }}

Yamaha Motor News

Yamaha Motor Releases New i-Cube10 (YRH10) Hybrid Placer

Complete redesign yields 50% greater mounting accuracy and production capability than previous models.

Read more…

05 {{ "2021-07-05T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-05T00:00:00+00:00" | date "longDate" }}

Telit News

Telit Announces FCC Certification of Modules for Anterix’s 900MHz Band Network

Telit, a global enabler of the Internet of Things (IoT), today announced that its ME310G1 and ME910G1 modules are certified by the FCC for use on the Anterix U.S. 900 MHz network frequency, with other modules expected soon.

Read more…

05 {{ "2021-07-05T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-05T00:00:00+00:00" | date "longDate" }}

NEC Corporation News

NEC commercializes Open RAN cloud-native software featuring high performance Massive MIMO and beamforming

NEC Corporation announced the launch of carrier-grade, cloud-native Open RAN software supporting its industry-leading digital beamforming of Massive MIMO (mMIMO, Note 1). The solution will be available globally from the beginning of 2022.

Read more…

02 {{ "2021-07-02T00:00:00+00:00" | date "MMM" }} '21

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Keysight technologies News

Keysight’s 5G Technology Speeds Development of Virtualized Open RAN Architectures and Delivery of Wireless Broadband Services

Joining forces with industry leaders at Mobile World Congress 2021, Keysight demonstrates solutions that accelerate 5G commercialization.

Read more…

02 {{ "2021-07-02T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-02T00:00:00+00:00" | date "longDate" }}

ST News

STMicroelectronics Eases Connected-Sensor Design with User-Friendly Workspace and Quick-Start Examples for BlueNRG SoCs

STMicroelectronics’ WiSE Studio, a free-of-charge Integrated Development Environment (IDE) dedicated to the BlueNRG system-on-chip (SoC) product family, is accelerating the design of smart, connected devices that leverage the latest Bluetooth^® technology.

Read more…

02 {{ "2021-07-02T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-02T00:00:00+00:00" | date "longDate" }}

TEKTRONIX News

Tektronix and Rapid Electronics announce increased technical partnership in the UK

Tektronix, a global leader in measurement technology, announces an increased technical partnership with Rapid Electronics, based in Colchester, UK.

Read more…

02 {{ "2021-07-02T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-02T00:00:00+00:00" | date "longDate" }}

Nexperia News

World’s smallest and thinnest standard logic DHXQFN packages from Nexperia in 14, 16, 20 and 24 pins

New packages enable large logic functions to be included in small form factor systems.

Read more…

Case studies

IDS: A deep look into the eye

White Paper

Parallel Operation of Power Supplies with User Systems

The Revolutions that Led to Chips Made Like Quilts

‘Behind the Builders:’ Intel Fellow Ravi Mahajan found packaging technologies were improving on a disturbingly straight line, inspiring an approach that was simple in concept but hard to pull off.

Nexperia obtains 100% ownership of Newport Wafer Fab, to be renamed Nexperia Newport

Welsh semiconductor plant to focus on MOSFETs, IGBT, Analog and Compound Semiconductor Automotive-grade products.

Souriau 8STA high performance, harsh environment, circular connectors from Lane Electronics

Lane Electronics, a leading franchised distributor for many of the industry’s major electrical and electronic connector manufacturers, are an added value “assembling distributor” for Eaton’s high performance Souriau8STA circular connectors .

Yamaha Motor Releases New i-Cube10 (YRH10) Hybrid Placer

Complete redesign yields 50% greater mounting accuracy and production capability than previous models.

Telit Announces FCC Certification of Modules for Anterix’s 900MHz Band Network

Telit, a global enabler of the Internet of Things (IoT), today announced that its ME310G1 and ME910G1 modules are certified by the FCC for use on the Anterix U.S. 900 MHz network frequency, with other modules expected soon.

NEC commercializes Open RAN cloud-native software featuring high performance Massive MIMO and beamforming

NEC Corporation announced the launch of carrier-grade, cloud-native Open RAN software supporting its industry-leading digital beamforming of Massive MIMO (mMIMO, Note 1). The solution will be available globally from the beginning of 2022.

Keysight’s 5G Technology Speeds Development of Virtualized Open RAN Architectures and Delivery of Wireless Broadband Services

Joining forces with industry leaders at Mobile World Congress 2021, Keysight demonstrates solutions that accelerate 5G commercialization.

STMicroelectronics Eases Connected-Sensor Design with User-Friendly Workspace and Quick-Start Examples for BlueNRG SoCs

STMicroelectronics’ WiSE Studio, a free-of-charge Integrated Development Environment (IDE) dedicated to the BlueNRG system-on-chip (SoC) product family, is accelerating the design of smart, connected devices that leverage the latest Bluetooth^® technology.

Tektronix and Rapid Electronics announce increased technical partnership in the UK

Tektronix, a global leader in measurement technology, announces an increased technical partnership with Rapid Electronics, based in Colchester, UK.

World’s smallest and thinnest standard logic DHXQFN packages from Nexperia in 14, 16, 20 and 24 pins

New packages enable large logic functions to be included in small form factor systems.

International

Case studies

White Paper

‘Behind the Builders:’ Intel Fellow Ravi Mahajan found packaging technologies were improving on a disturbingly straight line, inspiring an approach that was simple in concept but hard to pull off.

Welsh semiconductor plant to focus on MOSFETs, IGBT, Analog and Compound Semiconductor Automotive-grade products.

Lane Electronics, a leading franchised distributor for many of the industry’s major electrical and electronic connector manufacturers, are an added value “assembling distributor” for Eaton’s high performance Souriau8STA circular connectors .

Complete redesign yields 50% greater mounting accuracy and production capability than previous models.

Telit, a global enabler of the Internet of Things (IoT), today announced that its ME310G1 and ME910G1 modules are certified by the FCC for use on the Anterix U.S. 900 MHz network frequency, with other modules expected soon.

NEC Corporation announced the launch of carrier-grade, cloud-native Open RAN software supporting its industry-leading digital beamforming of Massive MIMO (mMIMO, Note 1). The solution will be available globally from the beginning of 2022.

Joining forces with industry leaders at Mobile World Congress 2021, Keysight demonstrates solutions that accelerate 5G commercialization.

STMicroelectronics’ WiSE Studio, a free-of-charge Integrated Development Environment (IDE) dedicated to the BlueNRG system-on-chip (SoC) product family, is accelerating the design of smart, connected devices that leverage the latest Bluetooth® technology.

Tektronix, a global leader in measurement technology, announces an increased technical partnership with Rapid Electronics, based in Colchester, UK.

New packages enable large logic functions to be included in small form factor systems.

International

STMicroelectronics’ WiSE Studio, a free-of-charge Integrated Development Environment (IDE) dedicated to the BlueNRG system-on-chip (SoC) product family, is accelerating the design of smart, connected devices that leverage the latest Bluetooth^® technology.