11 {{ "2021-10-11T00:00:00+00:00" | date "MMM" }} '21

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ESCHA News

Product Premieres at SPS 2021

At the SPS 2021 in Nuremberg, the German connectivity specialist ESCHA is giving an outlook on the coming trends and technologies that will shape the development of connectors in the coming years. The main focus will be on Single Pair Ethernet technology (SPE).

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11 {{ "2021-10-11T00:00:00+00:00" | date "MMM" }} '21

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Fischer Connectors

Fischer Connectors Showcases New Soldier Connectivity as Key Design Enabler to Address the Revolution in Military Affairs

“The new revolution is driven by a confluence of three digital technologies: ubiquitous full-spectrum sensing, 5G networks, and artificial intelligence” – Fischer Connectors in ‘The Connectivity Challenge’ (Trend Paper).

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11 {{ "2021-10-11T00:00:00+00:00" | date "MMM" }} '21

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Digi-key News

Digi-Key Electronics Named Distributor of the Year by METZ CONNECT

Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate shipment, was recognized with the Distributor of the Year award for 2020 from METZ CONNECT, a manufacturer of high-quality products that bring communication capability from the PCB to the infrastructure environment.

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11 {{ "2021-10-11T00:00:00+00:00" | date "MMM" }} '21

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Infineon News

World’s most powerful 1500 VDC string inverter: Infineon module and chip technology power 352 kW PV solution from Sungrow

With the launch of the latest 1500 V PV string inverter SG350HX, Sungrow offers a new market leading solution that features a maximum output power of 352 kW.

Read more…

09 {{ "2021-10-09T00:00:00+00:00" | date "MMM" }} '21

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TDK News

PRESSURE SENSORS: TDK OFFERS MINIATURIZED, HIGHLY SENSITIVE MEMS PRESSURE SENSOR ELEMENT

TDK Corporation (TSE:6762) presents the new C35 type pressure sensor element, designed to measure a range of 0 to 100 mbar. It combines high sensitivity with extremely low dimensions of just 2.05 x 2.05 x 1.2 mm, enabling compact pressure sensor designs.

Read more…

09 {{ "2021-10-09T00:00:00+00:00" | date "MMM" }} '21

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Rohm Semiconductors News

ROHM’S 75W HIGH OPTICAL OUTPUT LASER DIODE FOR LIDAR

High density emission along with the industry’s narrowest width supports longer distances and higher accuracy in LiDAR-equipped applications.

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08 {{ "2021-10-08T00:00:00+00:00" | date "MMM" }} '21

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ANSYS News

Ansys and Autodesk to Deliver Fusion 360 PCB Extension

Ansys and Autodesk to Deliver Fusion 360 PCB Extension.

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08 {{ "2021-10-08T00:00:00+00:00" | date "MMM" }} '21

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Micron News

Micron^® 7400 SSD With NVMe Delivers PCIe Gen4 Performance for Data Centers

World’s broadest family of NVMe data center SSDs features next-generation form factors and enhanced data security. Micron Technology, Inc., (Nasdaq: MU) today announced availability of the Micron^® 7400 SSD with NVMe, delivering industry-leading form factor flexibility, PCIe Gen4 performance, and leading-edge security to meet the storage needs of demanding data center workloads.

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08 {{ "2021-10-08T00:00:00+00:00" | date "MMM" }} '21

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Keysight technologies News

Keysight, NXP Collaborate to Advance Development of 5G Fixed Wireless Access (FWA) Solutions

Enables technology providers to verify consumer premises equipment (CPE). Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, is collaborating with NXP^® Semiconductors to advance the development of 5G Fixed Wireless Access (FWA) solutions. The multi-generation collaboration includes 5G market deployment of non-standalone (NSA) mode for the initial phase, as well as stand-alone (SA) for the future.

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08 {{ "2021-10-08T00:00:00+00:00" | date "MMM" }} '21

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NXP News

NXP and Partners Test Advanced V2X Application Scenarios for Collision-Free Driving

ITS World Congress -- NXP^® Semiconductors has announced that it will showcase new safety scenarios enabled by vehicle-to-vehicle communication (Vehicle-to-X or V2X) as part of this year’s ITS World Congress in Hamburg.

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Case studies

Mitutoyo's Measuring Machines and Equipment Ensuring Quality at Purso-Tools

Product Premieres at SPS 2021

At the SPS 2021 in Nuremberg, the German connectivity specialist ESCHA is giving an outlook on the coming trends and technologies that will shape the development of connectors in the coming years. The main focus will be on Single Pair Ethernet technology (SPE).

Fischer Connectors Showcases New Soldier Connectivity as Key Design Enabler to Address the Revolution in Military Affairs

“The new revolution is driven by a confluence of three digital technologies: ubiquitous full-spectrum sensing, 5G networks, and artificial intelligence” – Fischer Connectors in ‘The Connectivity Challenge’ (Trend Paper).

Digi-Key Electronics Named Distributor of the Year by METZ CONNECT

World’s most powerful 1500 VDC string inverter: Infineon module and chip technology power 352 kW PV solution from Sungrow

With the launch of the latest 1500 V PV string inverter SG350HX, Sungrow offers a new market leading solution that features a maximum output power of 352 kW.

PRESSURE SENSORS: TDK OFFERS MINIATURIZED, HIGHLY SENSITIVE MEMS PRESSURE SENSOR ELEMENT

TDK Corporation (TSE:6762) presents the new C35 type pressure sensor element, designed to measure a range of 0 to 100 mbar. It combines high sensitivity with extremely low dimensions of just 2.05 x 2.05 x 1.2 mm, enabling compact pressure sensor designs.

ROHM’S 75W HIGH OPTICAL OUTPUT LASER DIODE FOR LIDAR

High density emission along with the industry’s narrowest width supports longer distances and higher accuracy in LiDAR-equipped applications.

Ansys and Autodesk to Deliver Fusion 360 PCB Extension

Ansys and Autodesk to Deliver Fusion 360 PCB Extension.

Micron^® 7400 SSD With NVMe Delivers PCIe Gen4 Performance for Data Centers

Keysight, NXP Collaborate to Advance Development of 5G Fixed Wireless Access (FWA) Solutions

NXP and Partners Test Advanced V2X Application Scenarios for Collision-Free Driving

ITS World Congress -- NXP^® Semiconductors has announced that it will showcase new safety scenarios enabled by vehicle-to-vehicle communication (Vehicle-to-X or V2X) as part of this year’s ITS World Congress in Hamburg.

International

Case studies

At the SPS 2021 in Nuremberg, the German connectivity specialist ESCHA is giving an outlook on the coming trends and technologies that will shape the development of connectors in the coming years. The main focus will be on Single Pair Ethernet technology (SPE).

“The new revolution is driven by a confluence of three digital technologies: ubiquitous full-spectrum sensing, 5G networks, and artificial intelligence” – Fischer Connectors in ‘The Connectivity Challenge’ (Trend Paper).

With the launch of the latest 1500 V PV string inverter SG350HX, Sungrow offers a new market leading solution that features a maximum output power of 352 kW.

TDK Corporation (TSE:6762) presents the new C35 type pressure sensor element, designed to measure a range of 0 to 100 mbar. It combines high sensitivity with extremely low dimensions of just 2.05 x 2.05 x 1.2 mm, enabling compact pressure sensor designs.

High density emission along with the industry’s narrowest width supports longer distances and higher accuracy in LiDAR-equipped applications.

Ansys and Autodesk to Deliver Fusion 360 PCB Extension.

ITS World Congress -- NXP® Semiconductors has announced that it will showcase new safety scenarios enabled by vehicle-to-vehicle communication (Vehicle-to-X or V2X) as part of this year’s ITS World Congress in Hamburg.

International

ITS World Congress -- NXP^® Semiconductors has announced that it will showcase new safety scenarios enabled by vehicle-to-vehicle communication (Vehicle-to-X or V2X) as part of this year’s ITS World Congress in Hamburg.