Will reduce power consumption and costs of 400 Gbps optical transceivers for data centers. Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it will begin shipping samples of its 100Gbps (53Gbaud) four-level pulse-amplitude modulation (PAM4) electro-absorption modulator (EML) laser diode chip for coarse wavelength division multiplexing (CWDM) on November 1.
STMicroelectronics has released TouchGFX Version 4.18 for user-interface development with STM32* microcontrollers (MCUs), adding video playback, enhanced tools for multi-developer collaboration, and support for new X-NUCLEO display kits.
NEC Corporation (NEC; TSE: 6701) and Cisco today announced they have been selected by Telenor to deploy 5G xHaul transport networks in Norway and Denmark.
The new solution supports space applications requiring low outgassing and resistance to extreme temperatures. TE Connectivity (TE), a world leader in connectivity and sensors, is introducing its SolderSleeve device for space, a first-to-market solution that provides a controlled and reliable solder joint for low outgassing applications, including low earth orbit (LEO) satellites.
Diodes Incorporated (Nasdaq: DIOD) has announced the PI7C9X3G816GP, a PCIe® 3.0 packet switch that supports 16-lane operation in flexible 2-port, 3-port, 4-port, 5-port, and 8-port configurations.
Nicomatic engineers co-design with customers; as one-source supplier can incorporate other manufacturers’ devices; full custom design to production typically 12 weeks; no minimum order required.
The demands for seeing more and more details has pushed the evolution of resolution for years, from 480 pixels, 720 pixels all the way to 1080p and now 4K. With ever-growing resolution, the thirst for capacity has also challenged the status quo of video surveillance application.