21
'21
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Melexis News
21
'21
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Cadence News
Cadence and Samsung Accelerate 3nm Mixed-Signal Silicon
Samsung and Cadence co-develop Mixed-Signal OpenAccess-ready PDKs that enable seamless implementation and verification of mixed-signal designs for data centers, networking, 5G, mobile, industrial and automotive applications.
20
'21
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VIA Tech News
VIA Labs Announces Launch of USB4 Device Silicon
VL830 USB4 Endpoint Device features 40Gbps bandwidth with 8K Video and SuperSpeed USB support.
20
'21
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Infineon News
Infineon opens high-tech chip factory for power electronics on 300-millimeter thin wafers
Infineon Technologies AG today officially opened its high-tech chip factory for power electronics on 300-millimeter thin wafers at its Villach site in Austria under the motto “Ready for Mission Future.”
20
'21
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Acceed News
Rack PC with Nvidia GPUs and M12 connections
The now newly announced industrial Box PC SEMIL-1300GC from Acceed convinces with a clever extension concept.
20
'21
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Sivers Semiconductors News
Sivers Semiconductors’ Japanese lead customer takes important step towards mass production
Sivers Semiconductors AB today announces that its Japanese lead customer Fujikura, after several successful customer trials, is now preparing the start of full-scale, high-quality volume production of their 60 GHz communication module.
20
'21
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TEKTRONIX News
Tektronix Introduces S530 Parametric Test System with KTE V7.1 Software to Speed Semiconductor Chip Production
Tektronix, Inc., a leading worldwide provider of test and measurement solutions, today released KTE V7.1 software for the Keithley S530 Series Parametric Test System to help accelerate semiconductor chip manufacturing just when the world market needs it most.
20
'21
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RAFI News
E²MS for low-power applications
Today, the energy consumption of heating radiators is usually recorded and calculated fully automatically using smart meters.
20
'21
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CONTA-CLIP News
