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Melexis News

Melexis and emotion3D combine DMS and HUD dynamic object alignment in a single camera

Melexis, a global leader in automotive semiconductors, and emotion3D, a leading provider of camera-based automotive in-cabin analysis software, have joined forces to offer a unique 3D Time-of-Flight (ToF) demonstrator. The solution combines the driver monitoring system (DMS) with high-precision 3D driver localization, to dynamically align augmented reality head-up displays (AR HUD) objects.

Cadence News

Cadence and Samsung Accelerate 3nm Mixed-Signal Silicon

Samsung and Cadence co-develop Mixed-Signal OpenAccess-ready PDKs that enable seamless implementation and verification of mixed-signal designs for data centers, networking, 5G, mobile, industrial and automotive applications.

TEKTRONIX News

Tektronix Introduces S530 Parametric Test System with KTE V7.1 Software to Speed Semiconductor Chip Production

Tektronix, Inc., a leading worldwide provider of test and measurement solutions, today released KTE V7.1 software for the Keithley S530 Series Parametric Test System to help accelerate semiconductor chip manufacturing just when the world market needs it most.

RAFI News

E²MS for low-power applications

Today, the energy consumption of heating radiators is usually recorded and calculated fully automatically using smart meters.

CONTA-CLIP News

Tool-less round cable entries for cables with plugs

Conta-Clip completes its KDS-R modular cable entry program for round metric breakouts from M20 to M63, adding small-diameter versions for cables and conduits with cross-sections from 2 mm to 35 mm.

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