Sivers Semiconductors AB today announces that its Japanese lead customer Fujikura, after several successful customer trials, is now preparing the start of full-scale, high-quality volume production of their 60 GHz communication module.
Tektronix, Inc., a leading worldwide provider of test and measurement solutions, today released KTE V7.1 software for the Keithley S530 Series Parametric Test System to help accelerate semiconductor chip manufacturing just when the world market needs it most.
Conta-Clip completes its KDS-R modular cable entry program for round metric breakouts from M20 to M63, adding small-diameter versions for cables and conduits with cross-sections from 2 mm to 35 mm.
Pegasus Verification System qualification enables customers to confidently perform physical verification for hyperscale, aerospace 5G communications, consumer and automotive designs.
The Unify SDK will offer ready-made protocol-specific translations for Z-Wave and Zigbee (available today) with plans for Bluetooth, Thread, OpenSync and Matter, dramatically simplifying IoT wireless network interoperability and supporting companies as they scale smart home, city, building and industry ecosystems.
Fiber optics typically offers many advantages over conventional electrical and electronic systems, but often times a harsh environment can make the use of glass fiber difficult. Fortunately, the Diamond AVIM® connector family is specifically designed and built for these conditions.
Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), commences first deliveries of its high performance VX3060-S2 Blade PC. Based on 11th Gen Intel® Core processors, this underscores Kontron’s strong partnership with Intel, enabling the company to be first to market with a powerful and versatile space-saving 3U VPX single board PC.