With an area of one square millimeter, the NanEyeM is the smallest camera module with a fully digital output for medical endoscopes available on the market.
TDK Corporation (TSE:6762) has extended its range of coupled inductors to include the new EPCOS series B82472D6*. The nine series types cover an inductance range of 2 x 2.2 µH to 2 x 47 µH and are designed for maximum rated currents of 1.1 A to 4.3 A.
Intel Corporation today revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond. In addition to announcing RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power delivery method, the company highlighted its planned swift adoption of next-generation extreme ultraviolet lithography (EUV), referred to as High Numerical Aperture (High NA) EUV. Intel is positioned to receive the first High NA EUV production tool in the industry.
Transition to 200m wafers marks milestone in capacity build-up to support automotive and industrial markets in the electrification of their systems and products.
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Unilumin, a leader in LED displays based in China, announced that they have worked together to develop a new Unilumin display using the ST60A2, ST’s 60GHz RF transceiver for advanced high-data-rate contactless-transfer solutions.
TE Connectivity (TE), a world leader in connectivity and sensors, has launched its Rochester greaseless cable technology providing a more efficient field operation for downhole logging applications.
The universal Charx connect vehicle charging inlets from Phoenix Contact enable the AC and DC charging of all types of electric vehicles – from low charging power right through to High Power Charging (HPC) with up to 500 kW.