07 {{ "2021-06-07T00:00:00+00:00" | date "MMM" }} '21

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Intel News

Reinventing Chip Design from the Outside In

In the first ‘Behind the Builders,’ Intel Fellow Johanna Swan explains how chip packaging went from a basic utility to ‘a real inflection point, maximizing performance per volume.’

Read more…

07 {{ "2021-06-07T00:00:00+00:00" | date "MMM" }} '21

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Prysmian Group News

Prysmian Group protecting fibre networks and transmitted signals from hackers

Latest Industry Insight highlights the need for operators to leverage bend resistant solutions in order to fully secure network end-to-end.

Read more…

07 {{ "2021-06-07T00:00:00+00:00" | date "MMM" }} '21

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TTI News

TTI receives European Distribution Award from Abracon

TTI, Inc., a specialist distributor of electronic components, has been presented with another major accolade.

Read more…

07 {{ "2021-06-07T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-06-07T00:00:00+00:00" | date "longDate" }}

Sivers Semiconductors News

Sivers Semiconductors signs new reseller agreement for millimeter wave business in Japan

Sivers Semiconductors AB today announced that its subsidiary, Sivers Wireless, has signed a reseller agreement with Japanese electronics specialist Shoshin.

Read more…

07 {{ "2021-06-07T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-06-07T00:00:00+00:00" | date "longDate" }}

Fraunhofer News

Terahertz technologies for visionary innovations in communications and sensor technology

n the recently launched joint project "T-KOS" of the Research Fab Microelectronics Germany (FMD), terahertz technology is now to be developed synergistically for industry in the fields of communication and sensor technology for the first time.

Read more…

07 {{ "2021-06-07T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-06-07T00:00:00+00:00" | date "longDate" }}

ONSEMI News

ON Semiconductor Announces New Full Silicon Carbide MOSFET Module Solutions for Charging Electric Vehicles at APEC 2021

Comprehensive portfolio of wide bandgap devices for high-performance charging solutions.

Read more…

05 {{ "2021-06-05T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-06-05T00:00:00+00:00" | date "longDate" }}

Toshiba News

LATEST 1-FORM-B PHOTORELAY FROM TOSHIBA OFFERS 1.2A ON-STATE CURRENT RATING

Toshiba Electronics Europe GmbH (“Toshiba”) has further strengthened its extensive optoelectronics portfolio with the introduction of a new photorelay.

Read more…

04 {{ "2021-06-04T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-06-04T00:00:00+00:00" | date "longDate" }}

NXP News

NXP's Trimension Ultra-Wideband Technology Helps Samsung Users Easily Find Their Misplaced Belongings

NXP's UWB and Bluetooth^® technologies work together to provide greater location accuracy for Samsung Galaxy SmartTag+.

Read more…

04 {{ "2021-06-04T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-06-04T00:00:00+00:00" | date "longDate" }}

Micron News

Micron Accelerates Breakthrough Platform Innovation With Advancements Across Industry’s First 176-Layer NAND and 1-Alpha DRAM

Volume ramp of memory and storage portfolio additions power innovation across data center, intelligent vehicles and consumer devices.

Read more…

04 {{ "2021-06-04T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-06-04T00:00:00+00:00" | date "longDate" }}

Broadcom News

Broadcom Delivers Industry’s Broadest Portfolio of Fiber Optics, PHY and Switch Solutions for 100/200/400/800G Data Center Connectivity

Proven 100G EML and VCSEL optics and 112G Direct-Drive PAM-4 PHYs facilitate large-scale deployments and drive the next evolution of high bandwidth network connectivity.

Read more…

Market Overview

Sustainability in Electronic Components: Eco-Friendly Materials and Recycling Initiatives

Technical Articles

Leakage Current Considerations for Medical Power Supplies

Case studies

Inspecting critical infrastructure with the help of intelligent drones

White Paper

Leakage Current Considerations for Medical Power Supplies

Reinventing Chip Design from the Outside In

In the first ‘Behind the Builders,’ Intel Fellow Johanna Swan explains how chip packaging went from a basic utility to ‘a real inflection point, maximizing performance per volume.’

Prysmian Group protecting fibre networks and transmitted signals from hackers

Latest Industry Insight highlights the need for operators to leverage bend resistant solutions in order to fully secure network end-to-end.

TTI receives European Distribution Award from Abracon

TTI, Inc., a specialist distributor of electronic components, has been presented with another major accolade.

Sivers Semiconductors signs new reseller agreement for millimeter wave business in Japan

Sivers Semiconductors AB today announced that its subsidiary, Sivers Wireless, has signed a reseller agreement with Japanese electronics specialist Shoshin.

Terahertz technologies for visionary innovations in communications and sensor technology

n the recently launched joint project "T-KOS" of the Research Fab Microelectronics Germany (FMD), terahertz technology is now to be developed synergistically for industry in the fields of communication and sensor technology for the first time.

ON Semiconductor Announces New Full Silicon Carbide MOSFET Module Solutions for Charging Electric Vehicles at APEC 2021

Comprehensive portfolio of wide bandgap devices for high-performance charging solutions.

LATEST 1-FORM-B PHOTORELAY FROM TOSHIBA OFFERS 1.2A ON-STATE CURRENT RATING

Toshiba Electronics Europe GmbH (“Toshiba”) has further strengthened its extensive optoelectronics portfolio with the introduction of a new photorelay.

NXP's Trimension Ultra-Wideband Technology Helps Samsung Users Easily Find Their Misplaced Belongings

NXP's UWB and Bluetooth^® technologies work together to provide greater location accuracy for Samsung Galaxy SmartTag+.

Micron Accelerates Breakthrough Platform Innovation With Advancements Across Industry’s First 176-Layer NAND and 1-Alpha DRAM

Volume ramp of memory and storage portfolio additions power innovation across data center, intelligent vehicles and consumer devices.

Broadcom Delivers Industry’s Broadest Portfolio of Fiber Optics, PHY and Switch Solutions for 100/200/400/800G Data Center Connectivity

Proven 100G EML and VCSEL optics and 112G Direct-Drive PAM-4 PHYs facilitate large-scale deployments and drive the next evolution of high bandwidth network connectivity.

International

Market Overview

Technical Articles

Case studies

White Paper

In the first ‘Behind the Builders,’ Intel Fellow Johanna Swan explains how chip packaging went from a basic utility to ‘a real inflection point, maximizing performance per volume.’

Latest Industry Insight highlights the need for operators to leverage bend resistant solutions in order to fully secure network end-to-end.

TTI, Inc., a specialist distributor of electronic components, has been presented with another major accolade.

Sivers Semiconductors AB today announced that its subsidiary, Sivers Wireless, has signed a reseller agreement with Japanese electronics specialist Shoshin.

n the recently launched joint project "T-KOS" of the Research Fab Microelectronics Germany (FMD), terahertz technology is now to be developed synergistically for industry in the fields of communication and sensor technology for the first time.

Comprehensive portfolio of wide bandgap devices for high-performance charging solutions.

Toshiba Electronics Europe GmbH (“Toshiba”) has further strengthened its extensive optoelectronics portfolio with the introduction of a new photorelay.

NXP's UWB and Bluetooth® technologies work together to provide greater location accuracy for Samsung Galaxy SmartTag+.

Volume ramp of memory and storage portfolio additions power innovation across data center, intelligent vehicles and consumer devices.

Proven 100G EML and VCSEL optics and 112G Direct-Drive PAM-4 PHYs facilitate large-scale deployments and drive the next evolution of high bandwidth network connectivity.

International

NXP's UWB and Bluetooth^® technologies work together to provide greater location accuracy for Samsung Galaxy SmartTag+.