08
'21
Written on
OMRON News
08
'21
Written on
Keyence UK
New telecentric measurement system delivers breakthrough accuracy across multiple applications
Keyence has introduced a new range of inline telecentric measurement system which employ highly advanced silhouette-based analysis for guaranteed accuracy.
08
'21
Written on
Renesas News
Renesas Reimagines Remote Design With Enhanced Lab on the Cloud Environment
Cloud-Connected Lab Accelerates Board Configuration with Advanced New GUI and Testing for Voice, Mobile, and other Complex Applications.
08
'21
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Adlinktech News
ADLINK Launches Edge Vision Analytics (EVA) Software Development Kit (SDK) to Accelerate Edge AI Vision
EVA SDK lets users develop a POC for edge AI vision applications in two weeks.
08
'21
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ViewSonic
ViewSonic Announces Exclusive Partnership with Pantone, "ColorPro Talks – The Power of Colour"
Key Industry Creators and Experts to Host Masterclasses in Colour Precision and Management
08
'21
Written on
Rohm Semiconductors News
ROHM AND GEELY AUTOMOBILE GROUP FORM A STRATEGIC PARTNERSHIP FOCUSED ON SIC POWER DEVICES
Accelerating technical innovation in the automotive industry to achieve a sustainable society. The global semiconductor manufacturer ROHM, together with Geely Automobile Group Co., Ltd., a leading Chinese automobile manufacturer, have entered into a strategic partnership to develop advanced technologies in the automotive field.
07
'21
Written on
Datalogic News
DATALOGIC BRINGS SOLUTIONS FOR EVERY TRACEABILITY APPLICATION TO PACK EXPO 2021
Datalogic, a global leader in the automatic data capture and factory automation markets, is pleased to announce its participation at PACK EXPO 2021 in Las Vegas, with an extensive booth displaying traceability solutions for every application.
07
'21
Written on
TDK News
Development of an Image Diagnosis Technology Utilizing a High-Sensitivity Magnetic Sensor
Yokohama National University, a national university corporation (Yokohama-city, Kanagawa pref. President: Izuru Umehara, hereinafter “YNU”) and TDK Corporation (Tokyo, President: Shigenao Ishiguro, hereinafter “TDK”) have developed a prototype image diagnosis technology utilizing a high-sensitivity magnetic sensor*.
07
'21
Written on
ST News
STMicroelectronics Announces Mass-Market Availability of ST4SIM GSMA-compliant eSIMs for M2M Applications
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced mass-market availability of its ST4SIM, eSIM (embedded SIM) ICs for Machine-to-Machine (M2M) applications through e-distribution.
06
'21
Written on
Anritsu News
