Contemporary power system designs demand high power density levels and small form factors to maximize system-level performance. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) tackles this challenge by focusing on system innovation with enhancements on the component level.
Project Will Build Demonstrators for Transmitting and Receiving Qubits and Focus on Integrating the Technology in a Unique Platform to Address Quantum Computing Applications.
Arm Cortex-M4-based MCU Rich Peripherals Reduce Motor Control BOM Cost and Supports Predictive Maintenance Solution with Google’s TensorFlow Lite for Microcontrollers
Phoenix Contact provides a connector system for Single Pair Ethernet (SPE) which features a consistent pin connector pattern with degrees of protection from IP20 to IP67.
Infineon Technologies AG simplifies the design and implementation of secured smart home devices with a new evaluation kit based on an OPTIGA Trust M security solution for Raspberry Pi.
Dana Incorporated (NYSE: DAN) announced today that it has acquired a non-controlling stake in Pi Innovo LLC, a leader in embedded software solutions and electronics control units for the light vehicle, commercial vehicle, and off-highway markets.
What's new: CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design. The research will focus on assembly of smaller chiplets, optimizing interconnection technologies between the different elements of microprocessors, and on new bonding and stacking technologies for3D ICs, especially for making high performance computing (HPC) applications.