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Infineon News

Infineon adds 40 V device in PQFN to its OptiMOS Source-Down power MOSFET family

Contemporary power system designs demand high power density levels and small form factors to maximize system-level performance. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) tackles this challenge by focusing on system innovation with enhancements on the component level.

Phoenix Contact News

Ethernet finally goes the distance

Phoenix Contact provides a connector system for Single Pair Ethernet (SPE) which features a consistent pin connector pattern with degrees of protection from IP20 to IP67.

DANA INCORPORATED News

Dana Strengthens e-Propulsion Systems, Controls, Software, and Electronics Engineering Capabilities with Investment in Pi Innovo LLC

Dana Incorporated (NYSE: DAN) announced today that it has acquired a non-controlling stake in Pi Innovo LLC, a leader in embedded software solutions and electronics control units for the light vehicle, commercial vehicle, and off-highway markets.

Leti-cea News

CEA-Leti Announces Collaboration with Intel to Advance Chip Design Through Cutting-Edge 3D Packaging Technologies

​What's new: CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design. The research will focus on assembly of smaller chiplets, optimizing interconnection technologies between the different elements of microprocessors, and on new bonding and stacking technologies for3D ICs, especially for making high performance computing (HPC) applications.

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