14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

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Keysight technologies News

Keysight’s Test Solutions Selected by DEKRA to Verify 5G, Wi-Fi and Bluetooth Devices in Compliance to Regulatory Standards

Global test house expands use of Keysight’s test platforms to address growing adoption of 5G and IoT.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

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Anritsu News

Supporting 6 GHz Frequency Band Measurements for Wireless communication device Production Lines

MT8870A/MT8872A supports IEEE 802.11ax and NR-U 6 GHz band.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

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NEC Corporation News

Microsoft and NEC Expand Strategic Partnership to Boost Business Resiliency and Growth

Microsoft Corp. (Microsoft) and NEC Corporation (NEC; TSE: 6701) on Tuesday announced an expansion of their decades-long collaboration.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

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MIkroe News

MIKROE’s universal FUSION development board for all Microchip PIC microcontrollers ‘equipped with everything developers need’

FUSION for PIC v8 includes Wi-Fi debugging, Click peripheral sockets, SiBRAIN MCU sockets plus display options.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-14T00:00:00+00:00" | date "longDate" }}

CUI devices News

60 W Power-Only USB Type C Receptacle Features Vertical Orientation

CUI Devices’ Interconnect Group announced the continued expansion of their power-only USB Type C receptacle line with the introduction of a vertically-oriented model.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

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LEMO

Standard self-latching multipole connectors with alignment key

The LEMO B Series offers a modular, ergonomic, rugged and reliable circular multipole connector for applications needing quick and secure Push-Pull latching. Making it an ideal choice for test and measurement, instrumentation, medical devices, research and audio/video applications.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-14T00:00:00+00:00" | date "longDate" }}

Congatec News

NEW ULTRA-RUGGED 11TH GEN INTEL^® CORE^® CONGATEC MODULES WITH SOLDERED RAM

Congatec – a leading vendor of embedded and edge computing technology – introduces new 11th Gen Intel^® Core^® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-14T00:00:00+00:00" | date "longDate" }}

Cadence News

Cadence and UMC Collaborate on 22ULP/ULL Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs

Collaboration enables mutual customers to easily adopt the integrated Cadence digital full flow, which offers leading implementation and signoff technology for ultra-low power designs.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-14T00:00:00+00:00" | date "longDate" }}

Conrad News

New contact-free clamp meters from Fluke

Fluke 377 FC, 378 FC Non-Contact Voltage True-rms AC/DC Clamp Meters with iFlex.

Read more…

13 {{ "2021-07-13T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-13T00:00:00+00:00" | date "longDate" }}

TDK News

Aluminum electrolytic capacitors: TDK offers a new screw terminal series with high current capability and long service life

TDK Corporation (TSE:6762) presents the EPCOS aluminum electrolytic capacitors B43706* and B43726* series with screw terminals.

Read more…

Market Overview

Everything You Need to Know About FPGAs

Technical Articles

Leuze Technology Report Supercaps: Energy meets efficiency

Case studies

Layer by Layer: IDS Cameras Advance Precision Monitoring in Additive Manufacturing

Keysight’s Test Solutions Selected by DEKRA to Verify 5G, Wi-Fi and Bluetooth Devices in Compliance to Regulatory Standards

Global test house expands use of Keysight’s test platforms to address growing adoption of 5G and IoT.

Supporting 6 GHz Frequency Band Measurements for Wireless communication device Production Lines

MT8870A/MT8872A supports IEEE 802.11ax and NR-U 6 GHz band.

Microsoft and NEC Expand Strategic Partnership to Boost Business Resiliency and Growth

Microsoft Corp. (Microsoft) and NEC Corporation (NEC; TSE: 6701) on Tuesday announced an expansion of their decades-long collaboration.

MIKROE’s universal FUSION development board for all Microchip PIC microcontrollers ‘equipped with everything developers need’

FUSION for PIC v8 includes Wi-Fi debugging, Click peripheral sockets, SiBRAIN MCU sockets plus display options.

60 W Power-Only USB Type C Receptacle Features Vertical Orientation

CUI Devices’ Interconnect Group announced the continued expansion of their power-only USB Type C receptacle line with the introduction of a vertically-oriented model.

Standard self-latching multipole connectors with alignment key

The LEMO B Series offers a modular, ergonomic, rugged and reliable circular multipole connector for applications needing quick and secure Push-Pull latching. Making it an ideal choice for test and measurement, instrumentation, medical devices, research and audio/video applications.

NEW ULTRA-RUGGED 11TH GEN INTEL^® CORE^® CONGATEC MODULES WITH SOLDERED RAM

Congatec – a leading vendor of embedded and edge computing technology – introduces new 11th Gen Intel^® Core^® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance.

Cadence and UMC Collaborate on 22ULP/ULL Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs

Collaboration enables mutual customers to easily adopt the integrated Cadence digital full flow, which offers leading implementation and signoff technology for ultra-low power designs.

New contact-free clamp meters from Fluke

Fluke 377 FC, 378 FC Non-Contact Voltage True-rms AC/DC Clamp Meters with iFlex.

Aluminum electrolytic capacitors: TDK offers a new screw terminal series with high current capability and long service life

TDK Corporation (TSE:6762) presents the EPCOS aluminum electrolytic capacitors B43706* and B43726* series with screw terminals.

International

Market Overview

Technical Articles

Case studies

Global test house expands use of Keysight’s test platforms to address growing adoption of 5G and IoT.

MT8870A/MT8872A supports IEEE 802.11ax and NR-U 6 GHz band.

Microsoft Corp. (Microsoft) and NEC Corporation (NEC; TSE: 6701) on Tuesday announced an expansion of their decades-long collaboration.

FUSION for PIC v8 includes Wi-Fi debugging, Click peripheral sockets, SiBRAIN MCU sockets plus display options.

CUI Devices’ Interconnect Group announced the continued expansion of their power-only USB Type C receptacle line with the introduction of a vertically-oriented model.

The LEMO B Series offers a modular, ergonomic, rugged and reliable circular multipole connector for applications needing quick and secure Push-Pull latching. Making it an ideal choice for test and measurement, instrumentation, medical devices, research and audio/video applications.

Congatec – a leading vendor of embedded and edge computing technology – introduces new 11th Gen Intel® Core® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance.

Collaboration enables mutual customers to easily adopt the integrated Cadence digital full flow, which offers leading implementation and signoff technology for ultra-low power designs.

Fluke 377 FC, 378 FC Non-Contact Voltage True-rms AC/DC Clamp Meters with iFlex.

TDK Corporation (TSE:6762) presents the EPCOS aluminum electrolytic capacitors B43706* and B43726* series with screw terminals.

International

Congatec – a leading vendor of embedded and edge computing technology – introduces new 11th Gen Intel^® Core^® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance.