30 {{ "2021-04-30T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-04-30T00:00:00+00:00" | date "longDate" }}

Analog Devices News

Analog Devices and MDA Collaborate to Provide Electronic Beam Forming Technology for the Telesat Lightspeed Constellation, Enhancing Global Connectivity

Analog Devices, Inc. (Nasdaq: ADI) announced today a collaboration with MDA to deliver the beam forming integrated circuit (BFIC) to be used in MDA’s sophisticated phased array antenna for the Telesat Lightspeed low earth orbit (LEO) satellite constellation.

Read more…

30 {{ "2021-04-30T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-04-30T00:00:00+00:00" | date "longDate" }}

Mitsubishi Electric News

Mitsubishi Electric to Launch New X-Series HVIGBTs and HVDIODEs

7 new models will meet demands for smaller, more robust inverters systems in large equipment.

Read more…

30 {{ "2021-04-30T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-04-30T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas DDR5 I3C Bus Extension and SPD Hub Devices Qualified for AMI Firmware

Expanded I3C Ecosystem Now Includes Firmware, Software, and Hardware, Accelerating Product Qualification and Adoption for DDR5 Solutions.

Read more…

30 {{ "2021-04-30T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-04-30T00:00:00+00:00" | date "longDate" }}

Infineon News

2300 V isolated EiceDRIVER 2L-SRC Compact: Optimizing system efficiency and EMI in the most compact form factor

Highest efficiency is a key requirement for today’s power electronics. Therefore, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces its latest isolated EiceDRIVER 2L-SRC Compact (1ED32xx) gate driver family in a compact form factor.

Read more…

30 {{ "2021-04-30T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-04-30T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

New 600V IGBT IPMs Deliver Class-Leading Low Noise with Low Loss

Reducing power consumption and design load in compact industrial equipment and home appliances.

Read more…

30 {{ "2021-04-30T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-04-30T00:00:00+00:00" | date "longDate" }}

E-Consystems News

e-CAM82_USB - Sony STARVIS IMX415 4K Ultra-HD USB Camera

e-CAM82_USB is an ultra-low light 4K USB UVC camera based on the SONY STARVIS^® 1/2.8" IMX415 CMOS image sensor.

Read more…

29 {{ "2021-04-29T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-04-29T00:00:00+00:00" | date "longDate" }}

Sigmatek News

Small but Powerful: The ETT 764

7-inch multi-touch panel for web visualization.

Read more…

29 {{ "2021-04-29T00:00:00+00:00" | date "MMM" }} '21

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Keysight technologies News

Keysight Announces Customized GaN Test Board for the PD1500A Dynamic Power Device Analyzer/ Double-Pulse Tester

Delivers repeatable, reliable characterization of wide-bandgap semiconductors to reduce prototype cycles and speed introduction of new products.

Read more…

29 {{ "2021-04-29T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-04-29T00:00:00+00:00" | date "longDate" }}

NXP News

NXP Semiconductors and Truist Securities to Present The Evolution of Automotive Processing Teach-In

NXP Semiconductors N.V. (NASDAQ: NXPI) and Truist Securities will co-host a conference call for the investor and analyst community to provide an in-depth update and Q&A session on NXP’s innovative Automotive processing solutions.

Read more…

29 {{ "2021-04-29T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-04-29T00:00:00+00:00" | date "longDate" }}

Infineon News

New EasyDUAL CoolSiC MOSFET power modules with high-performance ceramic enable increased power density and more compact designs

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has upgraded the EasyDUAL CoolSiC MOSFET modules with a new aluminum nitride (AIN) ceramic.

Read more…

Technical Articles

TDK expands YFF Series filters to meet growing automotive safety demands

Case studies

IDS: Event-Based Cameras Enhance Flow Measurement in Science and Industry

Analog Devices and MDA Collaborate to Provide Electronic Beam Forming Technology for the Telesat Lightspeed Constellation, Enhancing Global Connectivity

Analog Devices, Inc. (Nasdaq: ADI) announced today a collaboration with MDA to deliver the beam forming integrated circuit (BFIC) to be used in MDA’s sophisticated phased array antenna for the Telesat Lightspeed low earth orbit (LEO) satellite constellation.

Mitsubishi Electric to Launch New X-Series HVIGBTs and HVDIODEs

7 new models will meet demands for smaller, more robust inverters systems in large equipment.

Renesas DDR5 I3C Bus Extension and SPD Hub Devices Qualified for AMI Firmware

Expanded I3C Ecosystem Now Includes Firmware, Software, and Hardware, Accelerating Product Qualification and Adoption for DDR5 Solutions.

2300 V isolated EiceDRIVER 2L-SRC Compact: Optimizing system efficiency and EMI in the most compact form factor

Highest efficiency is a key requirement for today’s power electronics. Therefore, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces its latest isolated EiceDRIVER 2L-SRC Compact (1ED32xx) gate driver family in a compact form factor.

New 600V IGBT IPMs Deliver Class-Leading Low Noise with Low Loss

Reducing power consumption and design load in compact industrial equipment and home appliances.

e-CAM82_USB - Sony STARVIS IMX415 4K Ultra-HD USB Camera

e-CAM82_USB is an ultra-low light 4K USB UVC camera based on the SONY STARVIS^® 1/2.8" IMX415 CMOS image sensor.

Small but Powerful: The ETT 764

7-inch multi-touch panel for web visualization.

Keysight Announces Customized GaN Test Board for the PD1500A Dynamic Power Device Analyzer/ Double-Pulse Tester

Delivers repeatable, reliable characterization of wide-bandgap semiconductors to reduce prototype cycles and speed introduction of new products.

NXP Semiconductors and Truist Securities to Present The Evolution of Automotive Processing Teach-In

NXP Semiconductors N.V. (NASDAQ: NXPI) and Truist Securities will co-host a conference call for the investor and analyst community to provide an in-depth update and Q&A session on NXP’s innovative Automotive processing solutions.

New EasyDUAL CoolSiC MOSFET power modules with high-performance ceramic enable increased power density and more compact designs

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has upgraded the EasyDUAL CoolSiC MOSFET modules with a new aluminum nitride (AIN) ceramic.

International

Technical Articles

Case studies

Analog Devices, Inc. (Nasdaq: ADI) announced today a collaboration with MDA to deliver the beam forming integrated circuit (BFIC) to be used in MDA’s sophisticated phased array antenna for the Telesat Lightspeed low earth orbit (LEO) satellite constellation.

7 new models will meet demands for smaller, more robust inverters systems in large equipment.

Expanded I3C Ecosystem Now Includes Firmware, Software, and Hardware, Accelerating Product Qualification and Adoption for DDR5 Solutions.

Highest efficiency is a key requirement for today’s power electronics. Therefore, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces its latest isolated EiceDRIVER 2L-SRC Compact (1ED32xx) gate driver family in a compact form factor.

Reducing power consumption and design load in compact industrial equipment and home appliances.

e-CAM82_USB is an ultra-low light 4K USB UVC camera based on the SONY STARVIS® 1/2.8" IMX415 CMOS image sensor.

7-inch multi-touch panel for web visualization.

Delivers repeatable, reliable characterization of wide-bandgap semiconductors to reduce prototype cycles and speed introduction of new products.

NXP Semiconductors N.V. (NASDAQ: NXPI) and Truist Securities will co-host a conference call for the investor and analyst community to provide an in-depth update and Q&A session on NXP’s innovative Automotive processing solutions.

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has upgraded the EasyDUAL CoolSiC MOSFET modules with a new aluminum nitride (AIN) ceramic.

International

e-CAM82_USB is an ultra-low light 4K USB UVC camera based on the SONY STARVIS^® 1/2.8" IMX415 CMOS image sensor.