‘Behind the Builders:’ Intel Fellow Ravi Mahajan found packaging technologies were improving on a disturbingly straight line, inspiring an approach that was simple in concept but hard to pull off.
Anritsu Corporation is pleased to announce that it has successfully verified a number of key 3GPP Release 16 features using its Radio Communication Test Station MT8000A in combination with Samsung Electronics’ System LSI Business latest 5G Exynos Modem.
With vacuum encapsulated technology, MTM Power's focus is on encapsulated, robust, long-living, temperature-resistant and absolutely maintenance-free modules.
Point-of-sale terminals (POS) are not sufficiently protected against physical attacks. Attackers can access sensitive data (such as credit card number and PIN codes) using probes or mini-drills. An additional security element in the security caps of the terminals can reliably prevent such attacks.
NEC Corporation announced the launch of carrier-grade, cloud-native Open RAN software supporting its industry-leading digital beamforming of Massive MIMO (mMIMO, Note 1). The solution will be available globally from the beginning of 2022.
Telit, a global enabler of the Internet of Things (IoT), today announced that its ME310G1 and ME910G1 modules are certified by the FCC for use on the Anterix U.S. 900 MHz network frequency, with other modules expected soon.
Free online simulation resource provides fast results with high accuracy and configurability for magnetic position sensor design, covering linear and rotary modes of operation.
Orange, Sierra Wireless, LACROIX, and STMicroelectronics announced the creation of the IoT Continuum – a partnership that aims to simplify and accelerate the mass deployment of IoT in Europe and beyond.